ENW-89811K4CF Panasonic - ECG, ENW-89811K4CF Datasheet
ENW-89811K4CF
Specifications of ENW-89811K4CF
Related parts for ENW-89811K4CF
ENW-89811K4CF Summary of contents
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Edition 2011-01-18 Published by Panasonic Electronic Devices Europe GmbH Zeppelinstrasse 19 D-21337 Lüneburg, Germany 2011 Panasonic Electronic Devices Europe GmbH © All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a ...
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... Due to better range with another ceramic antenna, we have updated module height from 1.8mm to 2.8mm. Changes made in If you need smaller height, let us discuss your individual case. Rev3.0 Releasing this document and correct the ordering code to ENW89811K4CF, which is the 85°C version Rev3.1 Add the ...
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... DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.3.1 Pad Driver and Input Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.3.2 Pull-ups and Pull-downs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.3.3 Protection Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.3.4 System Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.4 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.5 RF Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.5.1 Characteristics RF Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.5.1.1 Bluetooth Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 User’s Manual Hardware Description 4 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Table of Contents ...
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... Alternative 1: Dispensing Solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.6.2.2 Alternative 2: Printing Solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 9.7 Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 9.8 Component Salvage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 9.9 Voids in the Solder Joints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.9.1 Expected Void Content and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.9.2 Parameters with an Impact on Voiding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 User’s Manual Hardware Description 5 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Table of Contents ...
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... Pad Layout on the Module (top view Figure 12 Pin Marking Figure 13 Tape on Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 14 Eutectic Lead-Solder Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 15 Eutectic Leadfree-Solder Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 16 Solder Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 17 X-ray Picture Showing Voids Conforming to IPC-A-610D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 User’s Manual Hardware Description 6 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF List of Figures ...
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... Pull-up and Pull-down Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 11 Max. Load at the Different Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 12 BDR - Transmitter Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 13 BDR -Receiver Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 14 EDR - Transmitter Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 15 EDR -Receiver Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 16 Antennas User’s Manual Hardware Description 7 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF List of Tables ...
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... EEPROM • Testing • Enable DUT • Crystal calibration • H4 with UART HW flow control (RTS/CTS) • Security modes: Modes 1 and Mode 3 • Master-Slave role switch User’s Manual Hardware Description General Device Overview 8 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF ...
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... Pin Configuration LGA 1.0 0 0.6 Figure 2 Pin Configuration for PAN1321-SPP in Top View (footprint) User’s Manual Hardware Description EEPROM PMB8753/2 BlueMoon Balun UniCellular Crystal 26 MHz 15 PAN1321-SPP ENW89811K4CF General Device Overview Ceramic Antenna Filter / Matching PAN1321 _ Block_ Diagram.vsd 5 Revision 3.1, 2011-01-18 ...
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... PD VDD1 PD PD VDDUART Internal2 PU PU Internal2 PAN1321-SPP ENW89811K4CF General Device Overview Function Port 1.6 Hardware Reset Port 1.5 Port 1.8 1) Port 1.0 or JTAG interface Port 1.4 or JTAG interface Turns off module completely Sleep indication signal Port 0.9 Mode selection Port 1: 0: JTAG ...
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... VDDUART PAN1321-SPP ENW89811K4CF General Device Overview Function Port 0.14 LPM wakup input Port 0.7 or UART CTS flow control Port 0.4 or UART transmit data Port 0.6 or UART RTS flow control Power supply Regulated Power supply UART interface Power supply Power supply Ground ...
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... Example of a Bluetooth System using eUniStone User’s Manual Hardware Description AT command SPP(Serial Port Profile ) Loaded from EEPROM RFCOMM Stack BT Baseband 12 PAN1321-SPP ENW89811K4CF General Device Overview Figure 3 shows a typical HOST UART RESET interface API BT RF BALUN Antenna Example _Application_ PAN1311 .vsd Revision 3.1, 2011-01-18 ...
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... FW version PAN1321-SPP is available in different versions. Please check corresponding release documents for latest information. The identifier about the software version will be visible on the module, please refer xx. User’s Manual Hardware Description General Device Overview 13 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Figure 5, here ...
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... Clocking PAN1321-SPP contains a crystal from which the internal 26 MHz system clock is generated. Also, the low power mode clock of 32 kHz is generated internally, which means that no external clock is needed. User’s Manual Hardware Description Basic Operating Information 14 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF ...
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... Real Baud Rate 9615 19230 38461 57522 115044 230088 464285 928571 1857142 3250000 15 PAN1321-SPP ENW89811K4CF Interfaces Figure 4. PAN1321 UARTTXD UARTRXD UARTRTS UARTCTS P0.14 input P0.0 output Deviation Error (%) 0.16 0.16 ...
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... General Device Capabilities This chapter describes features available in the PAN1321 (ENW89811K4CF 22/xx) core. Actual feature set and how to access the features can be found in the AT Command document [1]. Release specific performance characteristics, like data speed, is related in the SW Release Notes [2]. 4.1 HCI+ The PAN1321 module can be programmed over UART with a specific application for RF test purposes, like TX continuous or TX burst mode. This test application is controlled over the UART through Infineon specific HCI commands. The commands supported by this test application are described in the document “ ...
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... Channel Quality Driven Data Rate change • Sniff, Hold • Role Switch • RSSI and Power Control • Power class 2 and 3 • Standard Bluetooth test mode, Active Tester Mode and RF Test Modes User’s Manual Hardware Description 17 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Bluetooth Capabilities ...
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... The HCI+ commands Infineon_Enable_CQDDR_Info_Sending and Infineon_Disable_CQDDR_Info_Sending turn on and off sending of the Infineon CQDDR Info event. This event provides information to the host every time a new CQDDR proposal is sent to a remote device. User’s Manual Hardware Description 18 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Bluetooth Capabilities ...
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... Ultra Low Transmit Power For high security devices the output power can be reduced to a value that reduces the communication range to a few inches. This mode is enabled with the HCI+ command Infineon_TX_Power_Config. User’s Manual Hardware Description 19 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Bluetooth Capabilities ...
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... Symbol Values Min. Typ. Max. -40 – 85 2.9 – 4.1 1.35 – 3.6 1.35 – 3.6 20 PAN1321-SPP ENW89811K4CF Electrical Characteristics Unit Note / Test Condition °C – V – V – V – V VSUPPLY > VSUPPLY < – According to MIL-STD883D method 3015.7 Unit Note / Test Condition ° ...
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... Values Min. Typ. Max. -0.3 – 0.2*VDDUART 0.7*VDDUART – VDDUART+0.3 V 0.7*VDDUART – 3.6 21 PAN1321-SPP ENW89811K4CF Electrical Characteristics Unit Note / Test Condition V – V – V IOL = IOH = - – pF – μA Input and output drivers disabled Unit Note / Test Condition V – ...
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... Values Min. Typ. Max. – – 0.7 1.7 – VSUPPLY -1 0. PAN1321-SPP ENW89811K4CF Electrical Characteristics Unit Note / Test Condition V IOL = 5 mA VDDUART = 2 IOL = 2 mA VDDUART = 2 IOH = -5 mA VDDUART = 2 IOH = -2 mA VDDUART = 2 – pF – μA Input and output drivers ...
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... N/A N/A 130 350 23 150 24 68 3.0 20 6.0 17 0.75 5.0 23 PAN1321-SPP ENW89811K4CF Electrical Characteristics Unit Conditions Max. μA N/A Pull-up current measured with pin voltage = 0 V μA 380 Pull-down current measured with pin voltage = μA 55 supply voltage Min measured at 125°C with supply = 1.35 V Typ. measured at 27° ...
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... PAN1321-SPP ENW89811K4CF Electrical Characteristics Peak current Note / Test Condition Default settings Maximum settings – – – – – – Max exceptions @ 52 MHz offset might be used – – – ...
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... Some spurious responses, but according to BT-specification -27 – – dBm – -27 – – dBm – 10 – – dBm Some spurious responses, but according to BT-specification 25 PAN1321-SPP ENW89811K4CF Electrical Characteristics Note / Test Condition – – – Revision 3.1, 2011-01-18 ...
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... Symbol Values Min. Typ. – -88 – -83 – -84 – -79 – -53 – -47 – -31 26 PAN1321-SPP ENW89811K4CF Electrical Characteristics Note / Test Condition Valid for all intermodulation tests – Unit Note / Test Condition dBm dB kHz – kHz – kHz – % – % – % – % – ...
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... PAN1321-SPP ENW89811K4CF Electrical Characteristics Note / Test Condition – – – – – – – – – – – – – – Revision 3.1, 2011-01-18 ...
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... All dimensions are in mm. Tolerances on all outer dimensions, height, width and length, are +/- 0.2 mm. User’s Manual Hardware Description HW/SW PCB Case 28 PAN1321-SPP ENW89811K4CF Package Information Version HW – Hardware Version SW – Software Version Machine readable 2D bar code Panasonic usage only, could be changed without any notice Production _Package ...
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... Pin 1 (A1) is marked on bottom footprint and on the top of the shield on the module according to Diameter of pin 1 mark on the shield is 0.15 mm. PAN1321 22/07 ENW89811K4CF 0902401 FCC ID:T7VEBMU Pin 1 marking top side Figure 7 Top View and Bottom View User’s Manual Hardware Description Pin 1 marking bottom side 29 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Package Information Figure ...
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... Important Application Information 8.1 Reference Design Figure 8 Reference Design Schematics User’s Manual Hardware Description Important Application Information 30 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF ...
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... There are no parts in ENW89811K4CF 22/xx that can be modified by the user except modifications of the device BD data and loading of SW patches. Any changes or modifications made to this device that are not expressly approved by Infineon, may void the user’ ...
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... European R&TTE Declaration of Conformity Hereby, Panasonic Electronic Devices Europe GmbH, declares that the Bluetooth module ENW89811K4CF 22/ compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end- ...
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... Bluetooth 2.0+EDR Module Brand name: PAN1321 / PAN1311 Model name: ENW89811K4CF / ENW89810K5CF to which this declaration relates compliance with all the applicable essential requirements, and other provisions of the European Council Directive: 1999/5/EC The conformity assessment procedure used for this declaration is Annex IV of this Directive. ...
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... Contains transmitter Module FCC ID: T7VEBMU / IC: 216QEBMU 8.10 Regulatory Test House The test house used by Panasonic in the Bluetooth and Regulatory approvals for the module PAN1321: Eurofins Product Service GmbH Storkower Str. 38c D-15526 Reichenwalde b. Berlin GERMANY Tel.: +49 33631 888 0 Fax: +49 33631 888 650 www.eurofins.com User’s Manual Hardware Description www ...
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... User’s Manual Hardware Description 15.6 mm 1.2 P0 .14 UARTCTS VDDUART UARTTXD UARTRTS P0 .0 P0.1 UARTRXD GND P0 .3 P0.2 GND GND VDD1 GND Ø0.6 ONOFF VSUPPLY VSUPPLY GND P1 PAN1321-SPP ENW89811K4CF Assembly Guidelines 5. 0 GND GND GND SLEEPX GND A9 Revision 3.1, 2011-01-18 ...
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... Pin 1 (A1) is marked on bottom footprint and on the top of the shield on the module according to Diameter of pin 1 mark on the shield is 0.15 mm. Pin 1 Ø150 µm Figure 2a: Top View 1,00 mm Figure 12 Pin Marking User’s Manual Hardware Description Figure 2b: Bottom View 36 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Assembly Guidelines Figure 12 ...
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... Package PAN1321 is packed in tape on reel according to Figure 13 Tape on Reel User’s Manual Hardware Description Figure 13. 37 PAN1321-SPP ENW89811K4CF Assembly Guidelines Revision 3.1, 2011-01-18 ...
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... Eutectic Leadfree-Solder Profile User’s Manual Hardware Description 235°C max. 220 ±5°C 200°C 90 ±30s 60 ~ 120 sec @ 3’C/sec max 8 minutes max 38 PAN1321-SPP ENW89811K4CF Assembly Guidelines 10 ±1s 30 +20/-10s Time [s] Lead _S older _P rof ile . sec max 60 ~ 150 sec 6’C/sec max Time [s] LeadF ree _S older _P rof ile ...
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... A dispenser with controlled volume must be used to assure the same volume on every pad. The volume on each 3 pad shall be about 0. Dispense 0. each LGA pad 2. Pick the module by a nozzle and place in the right position on the board 3. Reflow the solder. User’s Manual Hardware Description 39 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Assembly Guidelines ...
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... PCB has to be dried 24h at 125°C before soldering off the defect component, because otherwise too much moisture may have been accumulated. User’s Manual Hardware Description T ooling pins Fixture S older _P rint ing . Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Assembly Guidelines Figure 16. ...
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... Smaller powder size and higher metal load means more metal surface to deoxidize and thereby more entrapped flux and voiding. Higher metal load does also mean higher viscosity and more difficult for outgassed flux to remove from the solder. User’s Manual Hardware Description V oids 610D . Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Assembly Guidelines ...
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... Too short preheat time means that the flux does not get enough time to react and flux get entrapped in the solder and create voids. Too long reflow time gives larger voids Too short reflow time gives a fraction of voids User’s Manual Hardware Description 42 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Assembly Guidelines ...
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... Differential Phase Shift Keying (modulation) DQPSK Differential Quaternary Phase Shift Keying (modulation) DSP Digital Signal Processor DUT Device Under Test E EDR Enhanced Data Rate EEPROM Electrically Erasable Programmable Read Only Memory User’s Manual Hardware Description 43 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Terminology ...
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... Lower Address Part LM Link Manager LMP Link Manager Protocol LNA Low Noise Amplifier LO Local Oscillator LPM Low Power Mode(s) LPO Low Power Oscillator LSB Least Significant Bit/Byte LT_ADDR Logical Transport Address M User’s Manual Hardware Description 44 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Terminology ...
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... Receive RXD Receive Data (UART signal) S SCO Synchronous Connection-Oriented (logical transport) SIG Special Interest Group (Bluetooth SIG) SW Software SYRI Synthesizer Reference Input T TBD To Be Determined TCK Test Clock (JTAG signal) User’s Manual Hardware Description 45 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Terminology ...
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... Test Mode Select (JTAG signal) TX Transmit TXD Transmit Data (UART signal) U UART Universal Asynchronous Receiver & Transmitter ULPM Ultra Low Power Mode V VCO Voltage Controlled Oscillator W WLAN Wireless LAN (Local Area Network) User’s Manual Hardware Description 46 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF Terminology ...
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... References [1] SPP-AT Application on PAN1311; Software Version 1.1; Release Notes; Rev3.0 (PAN1311_SPP_AT_V10.03_V1.1_RN_Rev3.0.pdf) [2] SPP-AT User's Manual Software Description ; Rev3.0 (PAN1311_SPP_AT_V10.03_V1.1_UM_SD_Rev3.0.pdf) User’s Manual Hardware Description 47 Revision 3.1, 2011-01-18 PAN1321-SPP ENW89811K4CF References ...
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Published by Panasonic Electronic Devices Europe GmbH ...