ENW-89811K4CF Panasonic - ECG, ENW-89811K4CF Datasheet - Page 35

• Manufacturer Part Number: ENW-89811K4CF
• Description: MOD BLUETOOTH PAN1321
• Manufacturer: Panasonic - ECG

Specifications of ENW-89811K4CF

• Frequency: 2.4GHz
• Modulation Or Protocol: Bluetooth v2.0+EDR, Class 2
• Applications: General Purpose
• Power - Output: 2.5dBm
• Sensitivity: -86dBm
• Voltage - Supply: 2.9 V ~ 4.1 V
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5749238

9
The target of this document is to provide guidelines for customers to successfully introduce the PAN1321-SPP
module in production. This includes general description, PCB-design, solder printing process, assembly, soldering
process, rework and inspection.
9.1
PAN1321-SPP is a Land Grid Array (LGA 6x9) module made for surface mounting. The pad diameter is 0.6 mm
and the pitch 1.2 mm.
All solder joints on the module will reflow during soldering on the mother board. All components and shield will stay
in place due to wetting force. Wave soldering is not possible.
Surface treatment on the module pads is Nickel (5 - 8 µm)/Gold (0.04 - 0.10 µm).
Figure 11
Figure 11
9.2
The land pattern on the PCB shall be according to the land pattern on the module, which means that the diameter
of the LGA pads on the PCB shall be 0.6 mm. It is recommended that each pad on the PCB shall be surrounded
by a solder mask clearance of about 75 µm to avoid overlapping solder mask and pad.
9.3
The solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tin leadfree / lead
composition. A no-clean solder paste is preferred, since cleaning of the solder joints is difficult because of the small
gap between the module and the PCB.
Preferred thickness of the solder paste stencil is 100 - 127 µm (4 - 5 mils). The apertures on the solder paste stencil
shall be of the same size as the pads, 0.6 mm.
Hardware Description
User’s Manual
F1
E1
D1
C1
B1
A1
shows the pad layout on the module, seen from the component side.
VREG
GND
SDA0
P0 .10
GND
P1 .7
A1
Assembly Guidelines
General Description of the Module
Pad Layout on the Module (top view)
Printed Circuit Board Design
Solder Paste Printing
1.0
SCL 0
P0.8
P0.9
P1.8
P1.6
A2
TDI
0.6
RESET#
JTAG#
P0.11
A3
TDO
TCK
TMS
VSUPPLY
TRST#
RTCK
P0 .14
A4
P0 .0
P0 .3
UARTCTS
VSUPPLY VSUPPLY
ONOFF
VDD1
P0.1
P0.2
A5
VDDUART
UARTRXD
15.6 mm
A6
1.2
UARTTXD
GND
GND
A7
35
UARTRTS
Ø0.6
GND
GND
GND
P1.5
A8
SLEEPX
A9
GND
GND
GND
GND
5. 0
Revision 3.1, 2011-01-18
Assembly Guidelines
ENW89811K4CF
PAN1321-SPP