WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 3

• Manufacturer Part Number: WISMC03BI
• Description: MODULE LAN 802.11B/G BISM
• Manufacturer: Laird Technologies
• Series: EZURiOr

Specifications of WISMC03BI

• Frequency: 2.4GHz
• Data Rate - Maximum: 1Mbps
• Modulation Or Protocol: 802.11 b/g
• Applications: AMR, Automotive, ISM
• Power - Output: 15dBm
• Sensitivity: -86dBm
• Voltage - Supply: 3.3 V ~ 5.5 V
• Current - Transmitting: 250mA
• Data Interface: Connector, 50 Pin, DF-12
• Memory Size: 64Mbyte Flash, 16MByte SRAM
• Antenna Connector: U.FL
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Wireless Frequency: 2.412 GHz to 2.484 GHz
• Interface Type: UART
• Board Size: 22.8 mm x 33.8 mm x 7.6 mm
• Modulation: BPSK, CCK, DSSS, QPSK
• Security: WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Receiving: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

WISMC03BI
Wireless LAN Module / Device Server
TABLE OF
CONTENTS
3
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CONTENTS
WISMC03BI Wireless LAN Module / Device Server ... 4
Overview ..........................................................................4
WISMC03BI Key Features ................................................4
Specifications ............................................................... 5
Detailed Specifications .....................................................5
Block Diagram ..................................................................7
Mechanical Specifications .......................................... 8
Wireless LAN Module Dimensional Outline .....................8
Electrical Specifications .............................................. 9
40 Way Hirose Pin Descriptions .......................................9
Absolute Maximum Ratings ...........................................10
Recommended Operating Parameters ...........................10
RF Performance Specifications ................................. 12
Transmit Power / Receive Sensitivity ...............................12
Functional Description .............................................. 13
Interfaces ........................................................................13
UART Interface ...............................................................13
Bluetooth
GPIO Port ........................................................................14
ADC ................................................................................14
®
Coexistence .................................................14
Firmware Features ..................................................... 15
Command Set ................................................................15
Power Saving ...................................................................16
Application Information ............................................ 17
Antenna Location ...........................................................17
External Antenna .............................................................18
Power Supply Considerations ........................................18
Power-On Reset ..............................................................18
Operational Temperature ................................................18
Board to Board Connector and Stacking Height ...........19
Hirose Connector General Specification .........................19
Mounting the Module onto the Application Platform ...19
Fixing Pillars......................................................................20
Labelling ..........................................................................20
Ordering Information ......................................................20
Qualification ............................................................... 21
Qualification Process ......................................................21
Safety Information ..........................................................21
Certifications ...................................................................21
Related Documents ................................................... 22
Development Kit ............................................................22
Disclaimers ................................................................. 23
User Manual Status ........................................................23
Laird Technologies