WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 3
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WISMC03BI
Manufacturer Part Number
WISMC03BI
Description
MODULE LAN 802.11B/G BISM
Manufacturer
Laird Technologies
Series
EZURiOr
Specifications of WISMC03BI
Frequency
2.4GHz
Data Rate - Maximum
1Mbps
Modulation Or Protocol
802.11 b/g
Applications
AMR, Automotive, ISM
Power - Output
15dBm
Sensitivity
-86dBm
Voltage - Supply
3.3 V ~ 5.5 V
Current - Transmitting
250mA
Data Interface
Connector, 50 Pin, DF-12
Memory Size
64Mbyte Flash, 16MByte SRAM
Antenna Connector
U.FL
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Wireless Frequency
2.412 GHz to 2.484 GHz
Interface Type
UART
Board Size
22.8 mm x 33.8 mm x 7.6 mm
Modulation
BPSK, CCK, DSSS, QPSK
Security
WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
WISMC03BI
Wireless LAN Module / Device Server
TABLE OF
CONTENTS
3
www.lairdtech.com
CONTENTS
WISMC03BI Wireless LAN Module / Device Server ... 4
Overview ..........................................................................4
WISMC03BI Key Features ................................................4
Specifications ............................................................... 5
Detailed Specifications .....................................................5
Block Diagram ..................................................................7
Mechanical Specifications .......................................... 8
Wireless LAN Module Dimensional Outline .....................8
Electrical Specifications .............................................. 9
40 Way Hirose Pin Descriptions .......................................9
Absolute Maximum Ratings ...........................................10
Recommended Operating Parameters ...........................10
RF Performance Specifications ................................. 12
Transmit Power / Receive Sensitivity ...............................12
Functional Description .............................................. 13
Interfaces ........................................................................13
UART Interface ...............................................................13
Bluetooth
GPIO Port ........................................................................14
ADC ................................................................................14
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Coexistence .................................................14
Firmware Features ..................................................... 15
Command Set ................................................................15
Power Saving ...................................................................16
Application Information ............................................ 17
Antenna Location ...........................................................17
External Antenna .............................................................18
Power Supply Considerations ........................................18
Power-On Reset ..............................................................18
Operational Temperature ................................................18
Board to Board Connector and Stacking Height ...........19
Hirose Connector General Specification .........................19
Mounting the Module onto the Application Platform ...19
Fixing Pillars......................................................................20
Labelling ..........................................................................20
Ordering Information ......................................................20
Qualification ............................................................... 21
Qualification Process ......................................................21
Safety Information ..........................................................21
Certifications ...................................................................21
Related Documents ................................................... 22
Development Kit ............................................................22
Disclaimers ................................................................. 23
User Manual Status ........................................................23
Laird Technologies