WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 8
![MODULE LAN 802.11B/G BISM](/photos/14/19/141968/wismc03bi_sml.jpg)
WISMC03BI
Manufacturer Part Number
WISMC03BI
Description
MODULE LAN 802.11B/G BISM
Manufacturer
Laird Technologies
Series
EZURiOr
Specifications of WISMC03BI
Frequency
2.4GHz
Data Rate - Maximum
1Mbps
Modulation Or Protocol
802.11 b/g
Applications
AMR, Automotive, ISM
Power - Output
15dBm
Sensitivity
-86dBm
Voltage - Supply
3.3 V ~ 5.5 V
Current - Transmitting
250mA
Data Interface
Connector, 50 Pin, DF-12
Memory Size
64Mbyte Flash, 16MByte SRAM
Antenna Connector
U.FL
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Wireless Frequency
2.412 GHz to 2.484 GHz
Interface Type
UART
Board Size
22.8 mm x 33.8 mm x 7.6 mm
Modulation
BPSK, CCK, DSSS, QPSK
Security
WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
WISMC03BI
Wireless LAN Module / Device Server
MECHANICAL
SPECIFICATIONS
8
www.lairdtech.com
WIRELESS LAN MODULE DIMENSIONAL OUTLINE
All dimensions in mm
NOTES
The Module is equipped with a 40-pin 0.5mm pitch board-to-board connector that connects to
the application platform.
1. RF antenna
2. External Antenna connector (Hirose U.FL-R-SMT)
3. Board to board connector (Hirose connector)
4. 2.0mm maximum top side component height (excluding antenna)
5. 1.5mm maximum bottom side component height
6. 3.8mm max. pcb clearance for fixings body (top and bottom)
7. 40 way connector footprint
8. 2.2 +/- 0.075 fixing holes x 3
Laird Technologies