DC-WME-01T-S Digi International, DC-WME-01T-S Datasheet - Page 7
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DC-WME-01T-S
Manufacturer Part Number
DC-WME-01T-S
Description
WI-ME 8MB SDRAM 4MB FLASH SINGLE
Manufacturer
Digi International
Series
Digi Connect® Wi-MEr
Specifications of DC-WME-01T-S
Frequency
2.4GHz
Data Rate - Maximum
11Mbps
Modulation Or Protocol
802.11 b
Applications
General Purpose
Power - Output
16dBm
Sensitivity
-82dBm
Voltage - Supply
3.14 V ~ 3.45 V
Data Interface
PCB, Through Hole
Memory Size
4MB Flash, 8MB RAM
Antenna Connector
RP-SMA
Operating Temperature
-30°C ~ 75°C
Package / Case
Module
Wireless Frequency
2.4 GHz
Interface Type
SMA
Modulation
CCK, DBPSK, DQPSK
Security
64/128 WEP, WPA, 802.11i, TKIP
Operating Voltage
3.3 V
Antenna
SMA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Transmitting
-
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
NS7520
Other names
602-1037
About the Integration Kit
About the Development Kit
Scope of the Reference Manual
Kits Contents
About This Document
The purpose of this document is to enable developers to integrate the Digi Connect ME or
Digi Connect Wi-ME embedded modules with other devices, enabling these devices to
make use of the module’s rich networking features.
Note
This manual is intended for customers who use embedded modules Integration Kits or
Development Kits, which are described below.
The integration kit is the ideal platform for product evaluation, rapid prototyping, and
integration of the embedded modules. Targeted specifically at customers who want to take
advantage of the embedded modules with Digi plug-and-play firmware functionality, it
enables integration of the modules without any extensive embedded software development
with all the additional flexibility and benefits of web user interface customization and
application specific java applets.
The Digi Connect ME or Digi Connect Wi-ME Development Kit are easy-to-use and
royalty-free development platforms that significantly reduces traditional design risk and
accelerates the overall software development process. The kits deliver the integrated
• • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •
Unless mentioned specifically by name, the products will be referred to as the
embedded modules or modules. Individual naming is used to differentiate
product specific features.
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