ETRX357LR Telegesis Ltd, ETRX357LR Datasheet - Page 2

• Manufacturer Part Number: ETRX357LR
• Description: MODULE ZIGBEE W/PA LNA CHIP ANT
• Manufacturer: Telegesis Ltd

Specifications of ETRX357LR

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4 Zigbee
• Applications: ISM
• Power - Output: 18dBm
• Sensitivity: -105dBm
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 28mA
• Current - Transmitting: 106mA
• Data Interface: PCB, Surface Mount
• Memory Size: 192kB Flash, 12kB RAM
• Antenna Connector: On-Board, Chip
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 920-1007-2

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©2009 Telegesis (UK) Ltd
INTRODUCTION................................................................................................................... 5
PRODUCT APPROVALS ..................................................................................................... 6
MODULE PINOUT ................................................................................................................ 9
HARDWARE DESCRIPTION ............................................................................................. 11
FIRMWARE DESCRIPTION............................................................................................... 12
ABSOLUTE MAXIMUM RATINGS..................................................................................... 14
RECOMMENDED OPERATING CONDITIONS ................................................................. 14
DC ELECTRICAL CHARACTERISTICS ............................................................................ 15
DIGITAL I/O SPECIFICATIONS......................................................................................... 16
A/D CONVERTER CHARACTERISTICS ........................................................................... 17
AC ELECTRICAL CHARACTERISTICS ............................................................................ 17
PHYSICAL DIMENSIONS .................................................................................................. 20
SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 21
PRODUCT LABEL DRAWING ........................................................................................... 22
RECOMMENDED FOOTPRINT ......................................................................................... 23
RELIABILITY TESTS ......................................................................................................... 25
APPLICATION NOTES ...................................................................................................... 25
Hardware Description ........................................................................................................ 5
FCC Approvals................................................................................................................... 6
FCC Labelling Requirements............................................................................................. 6
European Certification ....................................................................................................... 7
Declarations of Conformity................................................................................................. 8
IEEE 802.15.4.................................................................................................................... 8
The ZigBee® Protocol ....................................................................................................... 8
Hardware Interface .......................................................................................................... 11
Custom Firmware............................................................................................................. 12
Software Interface............................................................................................................ 13
TX Power Characteristics ................................................................................................ 19
For Leaded Solder ........................................................................................................... 21
For Lead-free Solder........................................................................................................ 21
Example carrier board...................................................................................................... 24
Safety Precautions........................................................................................................... 25
Design Engineering Notes ............................................................................................... 25
Storage Conditions .......................................................................................................... 26
Table of Contents
- 2 -
ETRX35x Preliminary Product Manual
ETRX351 AND ETRX357