ETRX357LR Telegesis Ltd, ETRX357LR Datasheet - Page 21
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ETRX357LR
Manufacturer Part Number
ETRX357LR
Description
MODULE ZIGBEE W/PA LNA CHIP ANT
Manufacturer
Telegesis Ltd
Specifications of ETRX357LR
Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
ISM
Power - Output
18dBm
Sensitivity
-105dBm
Voltage - Supply
2.1 V ~ 3.6 V
Current - Receiving
28mA
Current - Transmitting
106mA
Data Interface
PCB, Surface Mount
Memory Size
192kB Flash, 12kB RAM
Antenna Connector
On-Board, Chip
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
920-1007-2
13 Soldering Temperature Time Profile (for reflow soldering)
13.1 For Leaded Solder
13.2 For Lead-free Solder
NB:
Maximum Reflow Cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2009 Telegesis (UK) Ltd
Recommended temp. profile
for reflow soldering
Our used temp. profile
for reflow soldering
Temp
Temp
150°C – 190°C
.[°C]
.[°C]
150 ±10°C
Figure 10. Temperature Profile for Lead-free Solder
230°C -250°C max.
Figure 9. Temperature Profile for Lead Solder
235°C max.
220 ±5°C
200°C
220°C
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90 ±30s
90 ±30s
ETRX35x Preliminary Product Manual
ETRX351 AND ETRX357
30 +20/-10s
30 +20/-10s
10 ±1s
Time [s]
Time [s]