SI1014-A-GM Silicon Laboratories Inc, SI1014-A-GM Datasheet - Page 212
SI1014-A-GM
Manufacturer Part Number
SI1014-A-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Specifications of SI1014-A-GM
Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
13dBm
Sensitivity
-121dBm
Voltage - Supply
0.9 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
30mA
Data Interface
PCB, Surface Mount
Memory Size
16kB Flash, 768B RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
13 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
768 B
Supply Current (max)
4 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1869-5
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Part Number
Manufacturer
Quantity
Price
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Part Number:
SI1014-A-GM
Manufacturer:
Silicon Laboratories Inc
Quantity:
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Si1010/1/2/3/4/5
clock’s duty cycle. This test should be performed at the worst case system conditions, as results at very
low temperatures or high supply voltage will vary from results taken at room temperature or low supply
voltage.
As an alternative to performing the oscillation robustness test, Automatic Gain Control may be disabled at
the cost of increased power consumption (approximately 200 nA). Disabling Automatic Gain Control will
provide the crystal oscillator with higher immunity against external factors which may lead to clock failure.
Automatic Gain Control must be disabled if using the SmaRTClock oscillator in self-oscillate mode.
Table 20.3 shows a summary of the oscillator bias settings. The SmaRTClock Bias Doubling feature allows
the self-oscillation frequency to be increased (almost doubled) and allows a higher crystal drive strength in
crystal mode. High crystal drive strength is recommended when the crystal is exposed to poor environmen-
tal conditions such as excessive moisture. SmaRTClock Bias Doubling is enabled by setting BIASX2
(RTC0XCN.5) to 1.
.
20.2.6. Missing SmaRTClock Detector
The missing SmaRTClock detector is a one-shot circuit enabled by setting MCLKEN (RTC0CN.6) to 1.
When the SmaRTClock Missing Clock Detector is enabled, OSCFAIL (RTC0CN.5) is set by hardware if
SmaRTClock oscillator remains high or low for more than 100 µs.
A SmaRTClock Missing Clock detector timeout can trigger an interrupt, wake the device from a low power
mode, or reset the device. See Section “12. Interrupt Handler” on page 134, Section “14. Power Manage-
ment” on page 157, and Section “18. Reset Sources” on page 185 for more information.
Note: The SmaRTClock Missing Clock Detector should be disabled when making changes to the oscillator settings in
212
RTC0XCN.
Figure 20.2. Interpreting Oscillation Robustness (Duty Cycle) Test Results
25%
Mode
Crystal
Self-Oscillate
Safe Operating Zone
Table 20.3. SmaRTClock Bias Settings
Bias Double Off, AGC On
Bias Double Off, AGC Off
Bias Double On, AGC On
Bias Double On, AGC Off
55%
Bias Double Off
Bias Double On
Low Risk of Clock
Rev. 1.0
Setting
Failure
60%
High Risk of Clock
Consumption
Failure
Highest
Lowest
600 nA
800 nA
Power
High
High
Low
Low
Duty Cycle
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