LMX9820ASMX/NOPB National Semiconductor, LMX9820ASMX/NOPB Datasheet

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... PA SYNTHESIZER CRYSTAL/OSCILLATOR CompactRISC is a trademark of National Semiconductor Corporation. Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. © 2007 National Semiconductor Corporation Based on National’s CompactRISC architecture and Digital Smart Radio technology, the LMX9820A is optimized to handle the data and link man- agement processing requirements of a Bluetooth node ...

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Features Bluetooth version 1.1 qualified Implemented in CMOS technology on FR4 substrate Temperature Range: -40°C to +85°C FCC certified on LMX9820ADONGLE, FCC ID ED9LMX9820ASM 3.1 DIGITAL HARDWARE Baseband and Link Management processors CompactRISC Core Integrated Memory: – Flash – ...

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General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 APPLICATIONS . . . . . . ...

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Connection Diagram GND RF GND RF GND GND RF GND RF GND GND RF GND RF GND GND RF GND ...

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Pad Descriptions Pad Pad Name Direction Location Clk- B8 Input Clk+ B9 Input 32kHz_CLKI B13 Input 32kHz_CLKO C13 Output RF_inout H8 Input/Output ISEL2 H13 Input ISEL1 J13 Input Table 3. USB Interface Signals (not supported by LMX9820A firmware) Pad ...

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Pad Descriptions (Continued) Table 5. Auxiliary Ports Interface Signals (Continued) Pad Pad Name Location Reset_b# G8 Reset_5100# D11 Lstat_0 E8 Lstat_1 F8 Host_wu F9 Env0 E9 Env1 B11 TX_Switch_P H3 Pad Pad Name Direction Location AAI_srd B10 AAI_std B12 ...

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Pad Descriptions (Continued) Table 8. Power, Ground, and No Connect Signals Pad Pad Name Location NC A1, A2, A3, A4, A5, A6, A7, A9, B1, C1, D1, D13, E1, E13, F1, G1, G7, H1, J1, J3, J6, J7, J9, ...

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... The following conditions apply unless otherwise stated in the tables below: • -40°C to +85°C A • 3.3V, IOV CC • RF system performance specifications are guaranteed on National Semiconductor Austin Board rev1.0b refer- ence design platform. Table 9. Absolute Maximum Ratings Min -0.3 -0.3 -0.5 -0.5 -65 Min 2 ...

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Electrical Specifications Table 11. Power Supply Electrical Specifications (Analog and Digital LDOs) Symbol 2 Analog Voltage Output Range VDD_ANA_OUT 3 Digital Voltage Output Range VDD_DIG_OUT 1. Typical operating conditions are V reflect voltages of internally generated, regulated voltages VDD_ANA ...

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Electrical Specifications 6.2 DC CHARACTERISTICS Symbol Parameter 1 Core Logic Supply Voltage Supply Voltage IOV CC V Logical 1 Input Voltage IH V Logical 0 Input Voltage Hysteresis Loop Width HYS I ...

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... MHz, in which For the typical case (Continued) • -40°C to +85°C A • 3.3V, IOV CC RF system performance specifications are guaranteed on National Semiconductor Austin Board rev1.0b reference design platform. Condition BER < 0.001 2.402 GHz 2.441 GHz 2.480 GHz MHz, ACI -60 dBm, in BER < 0.001 MHz ...

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Electrical Specifications Table 15. Transmitter Performance Characteristics Symbol Parameter 2 Transmit Output Power P RF OUT 5 Power Density Power Density MOD F1 Modulation Characteristics AVG 3 Modulation Characteristics MOD F2 MAX 4 Modulation Characteristics / F2 F1 AVG ...

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Electrical Specifications 6.4 PERFORMANCE DATA (TYPICAL) Figure 2. Modulation Figure 3. Transmit Spectrum -10 2.1E+09 Figure 6. Front-End Bandpass Filter Response (Continued) Figure 4. Corresponding Eye Diagram Figure 5. Synthesizer Phase Noise Filter Insertion ...

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Electrical Specifications m2 freq = 2.402 GHz S(1.1) = 0.093/-29.733 impedance = Z0* (1.170 - j0.109) m1 freq = 2.500 GHz S(1.1) = 0.035/175.614 impedance = Z0* (0.933 + j0.005) Figure 7. TX and RX Pin 50 Impedance Characteristics ...

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... Flash also contains the IEEE 802 compliant Media Access Con- troller (MAC) address (BDADDR). The firmware and the BDADDR are programmed by National Semiconductor or can be programmed by the customer either before assem- bly into the host system or in-system. Module firmware can also be updated during manufacturing or in-system using the ISP capabilities of the LMX9820A ...

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Functional Description 7.4.3 Interface Select Inputs (ISEL1, ISEL2) The interface selection pads are used for setting the UART speed and settings. If ISEL1 and ISEL2 are unconnected, they are pulled high by weak internal pullups, which select a default ...

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Digital Smart Radio 8.1 FUNCTIONAL DESCRIPTION The integrated Digital Smart Radio uses a heterodyne re- ceiver architecture with a low intermediate frequency (2 MHz), such that the intermediate frequency filters can be in- tegrated on-chip. The receiver consists of ...

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Digital Smart Radio (Continued) 8.6 TRANSMITTER CIRCUITRY The transmitter consists of ROM tables, two Digital to Ana- log (DA) converters, two low-pass filters, IQ mixers, and a power amplifier (PA). The ROM tables generate a digital IQ signal based ...

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Digital Smart Radio (Continued) 2. Crystal Pullability Pullability is another important parameter for a crystal, which is the change in frequency of a crystal with units of ppm/pF, either from the natural resonant frequency to a load resonant frequency ...

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Digital Smart Radio (Continued) Figure 11. Frequency Offset with 12 pF/12 pF Capacitors Figure 12. Frequency Offset with 10 pF/10 pF Capacitors www.national.com 20 ...

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Digital Smart Radio (Continued) 8.7.2 TCXO (Temperature Compensated Crystal Oscillator) The LMX9820A also can operate with an external TCXO (Temperature Compensated Crystal Oscillator). The TCXO signal is directly connected to the CLK+. 1. Input Impedance The LMX9820A CLK+ pin ...

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Digital Smart Radio (Continued) 8.7.4 ESR (Equivalent Series Resistance) LMX9820A can operate with a wide range of crystals with different ESR ratings. Reference Table 24 on page 22 and Figure 14 on page 22 for more details. Parameter External ...

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System Power-Up Sequence The following sequence must be performed to correctly power-up the LMX9820A: 1. Apply IOV and V to the LMX9820A VCC t IOVCC PTOR Reset_b# Low Reset_5100 Low BBP_CLOCK High TX_RX_DATA Low TX_RX_SYNC Low CCB_DATA ...

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Integrated Firmware The LMX9820A includes the full Bluetooth protocol stack up to RFComm to support the following profiles: — GAP (Generic Access Profile) — SDAP (Service Discovery Application Profile) — SPP (Serial Port Profile) Figure 17 shows the Bluetooth ...

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Power Reduction The LMX9820A supports several low-power modes to reduce power in different operating situations. The modular structure of the LMX9820A allows the firmware to power down unused modules. The low-power modes have influence on: • UART transport layer—enables ...

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Power Reduction (Continued) 11.2 UART TRANSPORT LAYER CONTROL 11.2.1 Hardware Wake-Up Functionality In some circumstances, the host may switch off the trans- port layer of the LMX9820A to reduce power consumption. The host and LMX9820A then may shut down ...

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Command Interface The LMX9820A offers Bluetooth functionality through either a self-contained slave functionality or a simple com- mand interface. The interface is carried over the UART interface. The following sections describe the protocol on the UART interface between the ...

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Command Interface (Continued) 12.2 COMMAND SET OVERVIEW The LMX9820A has a well-defined command set to: • Configure the device: – Hardware settings – Local Bluetooth parameters – Service database Command Inquiry Inquiry Complete Device Found Remote Device Name Remote ...

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Command Interface (Continued) Command Set Default Link Policy Set Default Link Policy Confirm Get Default Link Policy Get Default Link Policy Confirm Set Link Policy Set Link Policy Confirm Get Link Policy Get Link Policy Confirm Enter Sniff Mode ...

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Command Interface (Continued) Table 36. SPP Port Configuration and Status Commands Command Set Port Config Set Port Config Confirm Get Port Config Get Port Config Confirm Port Config Changed SPP Get Port Status SPP Get Port Status Confirm SPP ...

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Command Interface (Continued) Table 38. Local Service Database Configuration Commands Command Store SPP Record Store SPP Record Confirm Store DUN Record Store DUN Record Confirm Store FAX Record Store FAX Record Confirm Store OPP Record Store OPP Record Confirm ...

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Usage Scenarios 13.1 SCENARIO 1: POINT-TO-POINT CONNECTION LMX9820A acts only as slave, no further configuration is required. Example: Sensor with LMX9820A; hand-held device with standard Bluetooth option. Sensor Device UART Connected on Port L Microcontroller No Bluetooth™ commands necessary ...

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Usage Scenarios (Continued) 13.2 SCENARIO 2: AUTOMATIC POINT-TO-POINT CONNECTION LMX9820A at both sides. Example: Serial Cable Replacement. Device #1 controls the link setup with a few commands as described. Serial Device #1 1. Devices in Range? Inquiry Inquiry Result ...

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Usage Scenarios (Continued) 13.3 SCENARIO 3: POINT-TO-MULTIPOINT CONNECTION LMX9820A acts as master for several slaves. Example: Two sensors with LMX9820A; one hand-held master device with LMX9820A. Serial Devices #2 and #3 establish the link automatically as soon as they ...

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Application Information Figure 24 on page 35 represents a typical system sche- matic with optional 32KHz mounted for the LMX9820A. 14.1 MATCHING NETWORK The antenna matching network may or may not be required, depending upon the impedance of the ...

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Application Information www.national.com (Continued) Figure 25. Component Placement (Layer 1) 36 ...

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Application Information (Continued) Figure 26. Solid Ground Plane (Layer 2) Figure 27. Signal Plane (Layer 3) 37 www.national.com ...

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Application Information www.national.com (Continued) Figure 28. Component Layout Bottom (Layer 4) 38 ...

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Reference Design 39 www.national.com ...

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Soldering The LMX9820A bumps are designed to melt as part of the Surface Mount Assembly (SMA) process. In order to ensure reflow of all solder bumps and maximum solder joint reliability while minimizing damage to the package, recommended reflow ...

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Soldering (Continued) Figure 29. Typical Reflow Profiles 41 www.national.com ...

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... Specifications may change in any manner without no- tice. This datasheet contains preliminary data. Supplementary data will be published at a later date. National Semiconductor Corporation reserves the right to make changes at any time without notice in or- der to improve design and supply the best possible product.S This datasheet contains final specifications ...

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Datasheet Revision History Revision # (PDF Date) 1.0 draft 2 (April 2005) No functional Update 1.0 draft 3 (April 2005) Updated C/I in Table 14 1.0 (April 2005) No functional Update 1.1 Interim internal release. 1.2 (May 2006) NOPB ...

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Note www.national.com 44 ...

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Physical Dimension NOTES: PAD PITCH IS 1.00 MILLIMETER (.0394”) NON-ACCUMULATIVE. UNLESS OTHERWISE SPECIFIED, ALL DIMENSIONS ARE IN MILLIMETER. TOLERANCE, UNLESS OTHERWISE SPECIFIED: TWO PLACE (.00): ±.01 THREE PLACE (.000): ±.002 ANGULAR: ±1° Figure 30. Package with Sn-Pb Solder Bumps ...

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