MF1FCP2S50/DH,118 NXP Semiconductors, MF1FCP2S50/DH,118 Datasheet
MF1FCP2S50/DH,118
Specifications of MF1FCP2S50/DH,118
935272200118
MF1FCP2S50/DH-T
Related parts for MF1FCP2S50/DH,118
MF1FCP2S50/DH,118 Summary of contents
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ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors INTEGRATED CIRCUITS October 2004 ...
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Philips Semiconductors Flip Chip Package Specification CONTENTS 1 SCOPE ...................................................................................................................................... 3 2 SPECIFICATIONS ..................................................................................................................... 4 2.1 Integrated Circuit........................................................................................................................ 4 2.2 Absolute Maximum Ratings ........................................................................................................ 4 2.3 Electrical Characteristics ............................................................................................................ 4 3 ORDERING INFORMATION ...................................................................................................... 5 4 DEFINITIONS ............................................................................................................................ 6 5 ...
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Philips Semiconductors Flip Chip Package Specification 1 SCOPE This document specifies the product MF1FCP2S50: The MF1FCP2S50/DH is the integrated circuit MF1ICS50 in the package SOT732CA2. Therefore this document encompasses all information not covered by the specification of the package and/or ...
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Philips Semiconductors Flip Chip Package Specification 2 SPECIFICATIONS 2.1 Integrated Circuit Functionality of the integrated circuit is described in the MF1 IC S50 Functional Specification. 2.2 Absolute Maximum Ratings ABSOLUTE MAXIMUM RATINGS Operating Temperature ESD Voltage Immunity Input Current Storage ...
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Philips Semiconductors Flip Chip Package Specification 3 ORDERING INFORMATION Ordering Name MF1FCP2S50/DH Description Hot laminated backside tape 5 Product Specification Rev 3.1 October 2004 MF1 FCP2 S50 Ordering Code 12NC: 9352 722 00118 PUBLIC ...
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Philips Semiconductors Flip Chip Package Specification 4 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification ...
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Philips Semiconductors Flip Chip Package Specification 6 REVISION HISTORY Table 1 Addendum Flip Chip Package Specification Revision History REVISION DATE CPCN PAGE 3.1 Oct 2004 2004 01023 3.0 Dec 2002 2.0 June 2002 1.0 June 2002 Product Specification Rev 3.1 ...
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Philips Semiconductors - a worldwide company Contact Information For additional information please visit http://www.semiconductors.philips.com.Fax: + 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or ...