FSBB30CH60 Fairchild Semiconductor, FSBB30CH60 Datasheet

SMART POWER MODULE 30A SPM27-EA

FSBB30CH60

Manufacturer Part Number
FSBB30CH60
Description
SMART POWER MODULE 30A SPM27-EA
Manufacturer
Fairchild Semiconductor
Series
SPM™r
Type
IGBTr
Datasheet

Specifications of FSBB30CH60

Configuration
3 Phase
Current
30A
Voltage
600V
Voltage - Isolation
2500Vrms
Package / Case
SPM27EA
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FSBB30CH60_NL
FSBB30CH60_NL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FSBB30CH60
Manufacturer:
Fairchild Semiconductor
Quantity:
135
Part Number:
FSBB30CH60
Manufacturer:
JST
Quantity:
27 996
Part Number:
FSBB30CH60
Manufacturer:
FAIRCHILD
Quantity:
8 000
Part Number:
FSBB30CH60C
Manufacturer:
CML
Quantity:
101
Part Number:
FSBB30CH60C
Manufacturer:
Fairchild Semiconductor
Quantity:
180
Part Number:
FSBB30CH60C
Manufacturer:
FAIRCHILD
Quantity:
8 000
Part Number:
FSBB30CH60C
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
FSBB30CH60C
0
Company:
Part Number:
FSBB30CH60C
Quantity:
10
Company:
Part Number:
FSBB30CH60C
Quantity:
1 200
Company:
Part Number:
FSBB30CH60D
Quantity:
14 000
Company:
Part Number:
FSBB30CH60D
Quantity:
14 000
Part Number:
FSBB30CH60F
Manufacturer:
FAIRCHILD
Quantity:
8 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2007/12/08
Earliest Year/Work Week of Changed Product: 0750
Change Type Description: Bond Wire Material Composition
Description of Change (From): Au wire bonding in SPM27CA/DA/EA/FA package
Description of Change (To): Copper wire bonding in SPM27CA/DA/EA/FA package
Reason for Change : Add alternative raw material with same quality standard to decrease
material shortage risk
Qual/REL Plan Numbers : Q20070092
Qualification :
Passed and meet the FSC rel performance requirement
Change From
Change To
Results/Discussion
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Zhu, Adams
E-mail: Adams.Zhu@notes.fairchildsemi.com
Phone:
Date Issued On : 2007/04/06
Date Created : 2007/03/13
PCN# : Q1071103
Pg. 1

Related parts for FSBB30CH60

FSBB30CH60 Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

... Product Id Description : Affected FSIDs : FCAS50SN60 FPDB20PH60 FSAB20PH60 FSBB20CH60 96-HOURS 0/20 168-HOURS 500-HOURS 0/20 0/20 168-HOURS 500-HOURS 0/20 0/20 100-CYCLES 200-CYCLES 0/20 0/20 FPAB30PH60 FPDB30PH60 FSBB15CH60 FSBB20CH60F Failure Code 1000-HOURS Failure Code 0/20 1000-HOURS Failure Code 0/20 Failure Code FPAB50PH60 FPDB50PH60 FSBB15CH60F FSBB30CH60 Pg. 2 ...

Related keywords