EE-SX1107 Omron, EE-SX1107 Datasheet - Page 4

• Manufacturer Part Number: EE-SX1107
• Description: OPTO SENSOR SLOT TYPE 1MM SMT
• Manufacturer: Omron
• Type: Unamplifiedr

Specifications of EE-SX1107

• Sensing Distance: 0.039" (1mm)
• Sensing Method: Transmissive
• Output Configuration: Phototransistor
• Current - Dc Forward (if): 25mA
• Current - Collector (ic) (max): 20mA
• Voltage - Collector Emitter Breakdown (max): 20V
• Response Time: 10µs, 10µs
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Operating Temperature: -30°C ~ 85°C
• Aperture Width: 0.15 mm
• Termination Style: PCB
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 5mA
• Output Voltage: 20V
• Opto Case Style: SMD
• No. Of Pins: 4
• Peak Reflow Compatible (260 C): No
• Input Current Max: 5mA
• Body Style: Rectangular
• Brand/series: SX1
• Current, Switching: 20 mA
• Function: Vane
• Light Source: Red LED
• Output: NPN
• Primary Type: Photoelectric
• Sensing Mode: Transmissive
• Technology: Photoelectric
• Termination: Solder
• Voltage, Supply: 1.3 V
• Voltage, Switching: 20 V
• Operating Temperature Range: -30°C To +85°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: EESX1107; OR636TR

Precautions
■ Soldering Information
Reflow soldering
• The following soldering paste is recommended:
• The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm.
• Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.
Manual soldering
• Use ”Sn 60” (60% tin and 40% lead) or solder with silver content.
• Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 350 C or below.
• Solder each point for a maximum of three seconds.
• After soldering, allow the product to return to room temperature before handling it.
Storage
To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the
product under the following conditions:
The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time
the product must be stored under 30 C at 80% maximum humidity.
If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope
was opened, bake the product under the following conditions before use:
1 to 5 C/s
Melting temperature: 216 to 220 C
Composition: Sn 3.5 Ag 0.75 Cu
Temperature: 10 to 30 C
Humidity: 60% max.
Reel: 60 C for 24 hours or more
Bulk: 80 C for 4 hours or more
150 to 180 C
120 sec
Time
1 to 5 C/s
10 sec max.
40 sec max.
260 C max.
255 C max.
230 C max.
EE-SX1107
Photomicrosensor (Transmissive)
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