MPXH6300A6U Freescale Semiconductor, MPXH6300A6U Datasheet - Page 4

• Manufacturer Part Number: MPXH6300A6U
• Description: SENSOR ABS PRESS 42PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPXH6300r

Specifications of MPXH6300A6U

• Pressure Type: Absolute
• Operating Pressure: 3 ~ 42 PSI
• Output: 0 ~ 4.9V
• Voltage - Supply: 4.85 V ~ 5.35 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP without Port
• Accuracy: 1.5 %
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5.1 V
• Supply Voltage (min): 4.74 V
• Supply Voltage (max): 5.46 V
• Supply Current: 6 mA
• Output Voltage: 4.9 V
• Shutdown: No
• Operating Pressure Range: 20 To 304kPa
• Sensitivity, V/p: 16.2mV/kPa
• Sensor Case Style: SSOP
• No. Of Pins: 8
• Supply Voltage Range: 4.74V To 5.46V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXH6300A
4
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 1317).
illustrates a typical application circuit (output source current
operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 2
Figure 4
Pressure
Sealed Vacuum Reference
Fluoro Silicone
Wire Bond
Frame
Gel Die Coat
Lead
illustrates the absolute sensing chip in the basic
shows the sensor output signal relative to
Absolute Element
P1
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Die
Transfer Function:
V
V
Temperature = 0 to 85°C
Figure 4. Output vs. Absolute Pressure
out
S
= 5.1 Vdc
= V
Figure 3
s
Die Bond
*(.00318*P-.00353) ± Error
Pressure (Reference to Sealed Vacuum) in kPa
Thermoplastic
Steel Cap
Stainless
MAX
Case
MIN
100 nF
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6300A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
A fluorosilicone gel isolates the die surface and wire bonds
TYP
+5.1 V
Figure 3. Typical Application Circuit
(Output Source Current Operation)
V
GND Pin 3
S
MPXH6300A
Pin 2
V
out
Pin 4
Freescale Semiconductor
47 pF
51 K
Sensors
to ADC