MPX2200AP Freescale Semiconductor, MPX2200AP Datasheet - Page 4

• Manufacturer Part Number: MPX2200AP
• Description: SENSOR ABS PRESS 29PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX2200r

Specifications of MPX2200AP

• Pressure Type: Absolute
• Operating Pressure: 29 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 40mV
• Voltage - Supply: 16V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP
• Mounting Style: Screw
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 10 V
• Function: Pressure
• Primary Type: Pressure
• Range, Measurement: 200 kPa
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPX2200
4
On-Chip Temperature Compensation and Calibration
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
the equation: V
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 2
Figure 3
The MPX2200 series pressure sensor operating
Linearity refers to how well a transducer's output follows
Conversely, an end point fit will give the “worst case” error
Pressure
Lead Frame
Wire Bond
Die Coat
Silicone Gel
shows the output characteristics of the MPX2200
illustrates the differential/gauge die in the basic
OUT
= V
OFF
Differential/Gauge
Die
LINEARITY
Differential/Gauge
+ sensitivity x P over the operating
PSI
kPa
P1
P2
40
35
30
25
20
15
10
-5
5
0
0
Figure 3. Cross Sectional Diagram (not to scale)
VS = 10 V
T
P1 > P2
Element
A
Figure 2. Output vs. Pressure Differential
= 25°C
25
Stainless Steel
Metal Cover
Figure
MAX
DC
7.25
50
4) or
75
Bond
Die
Epoxy
Case
TYP
Pressure
14.5
100
MIN
125
very small and are shown under Operating Characteristics.
Lead Frame
Wire Bond
The effects of temperature on full scale span and offset are
0
21.75
150
Exaggerated
Performance
Curve
Least Squares Fit
Figure 4. Linearity Specification Comparison
Silicone Gel
Die Coat
Offset
175
200
29
Pressure (% Full Scale)
Range
Span
(TYP)
Absolute
End Point Straight
Line Fit
Offset
Die
50
(TYP)
Absolute Element
P1
P2
Freescale Semiconductor
Stainless Steel
Metal Cover
100
Straight Line
Deviation
Least
Square
Deviation
Bond
Die
Sensors
Epoxy
Case