MPXV4006GP Freescale Semiconductor, MPXV4006GP Datasheet
MPXV4006GP
Specifications of MPXV4006GP
Related parts for MPXV4006GP
MPXV4006GP Summary of contents
Page 1
... Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement • Respiratory Equipment Option Device Surface Through- Marking Mount Hole MZ4006GW • MZ4006GW • MPVZ4006G • MPVZ4006G • MPVZ4006G • MPXV4006G • MPXV4006G • MPXV4006G • MPXV4006GP • MPXV4006DP • ...
Page 2
... Pressure SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV4006GC6U/C6T1 CASE 482A-01 MPVZ4006GW7U CASE 1560-02 MPXV4006 2 MPVZ4006G6U/T1 MPVZ4006GW6U CASE 482-01 CASE 1735-01 MPXV4006DP CASE 1351-01 SMALL OUTLINE PACKAGE THROUGH-HOLE J MPVZ4006G7U CASE 482B-03 MPXV4006GP CASE 1369-01 MPXV4006GC7U CASE 482C-03 Sensors Freescale Semiconductor ...
Page 3
... The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. Sensors Freescale Semiconductor = 5.0 Vdc 25°C unless otherwise noted, P1 > P2) ...
Page 4
... T stg Gain Stage #2 Thin Film and Temperature Compensation Ground and Reference Gain Stage #1 Shift Circuitry Pins and 8 are NO CONNECTS 3 for small outline package device GND Value Units 24 kPa °C -30° to +100° °C +10° to +60° out Sensors Freescale Semiconductor ...
Page 5
... V (without auto zero, Note 5 in FSS Operating Characteristics) Sensors Freescale Semiconductor qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller ...
Page 6
... MPVZ4006GW6U MPVZ4006GW7U MPVZ4006G6U/T1 MPVZ4006G7U MPXV4006GC6U/T1 MPXV4006GC7U MPXV4006GP MPXV4006DP MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...
Page 7
... Sensors Freescale Semiconductor CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE Pressure MPXV4006 7 ...
Page 8
... Pressure MPXV4006 8 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...
Page 9
... Sensors Freescale Semiconductor CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Pressure MPXV4006 9 ...
Page 10
... Pressure MPXV4006 10 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...
Page 11
... - - DETAIL X Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 -T- SEATING PIN 1 IDENTIFIER PLANE CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE 0.25 (0.010 DETAIL X PIN 1 IDENTIFIER SEATING -T- PLANE K CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...
Page 12
... G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1. 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 –T– SEATING PLANE Sensors Freescale Semiconductor ...
Page 13
... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE Pressure MPXV4006 13 ...
Page 14
... Pressure MPXV4006 14 PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...
Page 15
... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE Pressure MPXV4006 15 ...
Page 16
... Pressure MPXV4006 16 PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...
Page 17
... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE Pressure MPXV4006 17 ...
Page 18
... Pressure MPXV4006 18 PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...
Page 19
... N –B– Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 DETAIL X W PIN 1 IDENTIFIER C –T– DETAIL X CASE 482C-03 ISSUE A SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION ...
Page 20
... BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 θ 0˚ 7˚ 0˚ 7˚ Sensors Freescale Semiconductor ...
Page 21
... PLACES 4 TIPS 0.008 (0.20 ∅ 0.004 (0. DETAIL G C Sensors Freescale Semiconductor PACKAGE DIMENSIONS GAGE e PLANE e/2 .014 (0.35) b 0.004 (0. SEATING PLANE CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE Pressure θ DETAIL G NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. ...
Page 22
... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...