MPX5050DP Freescale Semiconductor, MPX5050DP Datasheet - Page 5

• Manufacturer Part Number: MPX5050DP
• Description: SENSOR DIFF PRESS 7.25 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX5050r

Specifications of MPX5050DP

• Pressure Type: Differential
• Operating Pressure: 7.25 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Dual Ports
• Accuracy: 2.5 %
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 7 mA
• Output Voltage: 4.7 V
• Shutdown: No
• Brand/series: MPX5050
• Current, Rating: 7 mAdc
• Function: Pressure
• Mounting Type: PCB
• Pressure, Operating: 0 to 7.25 PSI
• Primary Type: Pressure
• Range, Measurement: 7.25 PSI
• Response Time: 1 ms
• Sensing Mode: Strain Gauge
• Sensitivity: 90 mV⁄kPa
• Technology: Piezoresistive
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -40 °C
• Termination: Solder
• Vg, Rating: 5 VDC
• Voltage, Offset: 0.2 VDC
• Voltage, Supply: 5 VDC
• Operating Pressure Range: 0 To 50kPa
• Connection Size: 4.928mm
• Sensitivity, V/p: 90mV/kPa
• Sensor Case Style: SIP
• No. Of Pins: 6
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
On-chip Temperature Compensation and Calibration
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
Figure 3
The MPX5050/MPXV5050G series pressure sensor
illustrates the Differential/Gauge Sensing Chip in
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Lead Frame
Wire Bond
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Figure 3. Cross-Sectional Diagram (not to scale)
0
1.0 μF
Transfer Function:
V
V
TEMP = 0 to 85°C
Fluorosilicone
Gel Die Coat
out
S
Figure 2. Output vs. Pressure Differential
= 5.0 Vdc
= V
5
S
*(0.018*P+0.04) ± ERROR
MAX
10
0.01 μF
15
Differential/Gauge Element
Differential Pressure (kPa)
Die
20
V
s
+5 V
GND
25
IPS
P2
P1
factory for information regarding media compatibility in your
application.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range.
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
V
30
out
Figure 2
Figure 4
MIN
35
Stainless Steel
Metal Cover
40
shows the sensor output signal relative to
shows the recommended decoupling circuit for
470 pF
TYPICAL
45
OUTPUT
50
Plastic
Epoxy
Bond
Case
Die
55
Pressure
Figure
MPX5050
4. The
5