MPX5010DP Freescale Semiconductor, MPX5010DP Datasheet - Page 5

• Manufacturer Part Number: MPX5010DP
• Description: SENSOR DIFF PRESS 1.45 PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPX5010r

Specifications of MPX5010DP

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI
• Port Size: Male, 0.194" (4.9276mm) Tube
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Dual Ports
• Accuracy: 5 %
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 5 mA
• Output Voltage: 4.7 V
• Shutdown: No
• Brand/series: MPX5010
• Current, Rating: 5 mAdc
• Function: Pressure
• Mounting Type: PCB
• Pressure, Operating: 0 to 1.45 PSI
• Primary Type: Pressure
• Range, Measurement: 1.45 PSI
• Response Time: 1 ms
• Sensing Mode: Strain Gauge
• Sensitivity: 450 mV⁄kPa
• Technology: Piezoresistive
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -40 °C
• Termination: Solder
• Vg, Rating: 5 VDC
• Voltage, Offset: 0.2 VDC
• Voltage, Supply: 5 VDC
• Operating Pressure Range: 0 To 10kPa
• Connection Size: 4.928mm
• Sensitivity, V/p: 450mV/kPa
• Sensor Case Style: SIP
• No. Of Pins: 6
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
Frame
The performance over temperature is achieved by
Figure 3
The MPxx5010G series pressure sensor operating
Lead
Wire Bond
Figure 2. Cross-Sectional Diagram SOP
illustrates the Differential or Gauge configuration
Differential Sensing
Fluoro Silicone
Gel Die Coat
Element
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
(not to scale)
P1
P2
5.0
4.0
3.0
2.0
1.0
0
0
Die
Figure 4. Output vs. Pressure Differential
Transfer Function (kPa):
V
V
TEMP = 0 to 85°C
out
S
= 5.0 Vdc
= V
MAX
S
× (0.09 × P + 0.04) ± 5.0% V
2.0
Steel Cap
Stainless
Die Bond
Differential Pressure (kPa)
Thermoplastic
4.0
Case
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range.
MIN
Figure 4
Figure 5
Figure 3. Recommended Power Supply Decoupling
FSS
6.0
1.0 μF
(For additional output filtering, please refer to
shows the recommended decoupling circuit for
shows the sensor output signal relative to
TYPICAL
8.0
Application Note AN1646.)
and Output Filtering
0.01 μF
10
V
s
+5 V
GND
IPS
V
out
Pressure
Figure
470 pF
MPX5010
OUTPUT
4. The
5