MPXH6115AC6T1 Freescale Semiconductor, MPXH6115AC6T1 Datasheet - Page 5

• Manufacturer Part Number: MPXH6115AC6T1
• Description: SENSOR ABS PRESS 16.7PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPXH6115r

Specifications of MPXH6115AC6T1

• Pressure Type: Absolute
• Operating Pressure: 2.2 ~ 16.7 PSI
• Output: 0 ~ 4.8V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP with Port
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Output Voltage: 4.633 V to 4.768 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MPXH6115AC6T1TR

Sensors
Freescale Semiconductor
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 1317).
current operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 2
Figure 3
Figure 4
illustrates the absolute sensing chip in the basic
shows a typical application circuit (output source
shows the sensor output signal relative to
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
100 nF
Wire Bond
Fluorosilicone
Frame
Gel Die Coat
Lead
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Transfer Function:
V
V
TEMP = 0 to 85ºC
out
S
Figure 4. Output vs. Absolute Pressure
= 5.0 Vdc
Figure 3. Typical Application Circuit
= V
(Output Source Current Operation)
+5.0 V
s
* (.009*P-.095) ± Error
V
GND Pin 3
S
MPXxx6115A
Pin 2
Pressure (ref: to sealed vacuum) in kPa
Absolute Element
V
out
P1
Pin 4
MIN
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Die
A fluorosilicone gel isolates the die surface and wire bonds
MAX
47 pF
Die Bond
Thermoplastic
Steel Cap
Stainless
Case
51 K
to ADC
TYP
Pressure
MPXA6115A
5