MPVZ5010G6T1 Freescale Semiconductor, MPVZ5010G6T1 Datasheet - Page 4

• Manufacturer Part Number: MPVZ5010G6T1
• Description: PRESSURE SENSOR SS CAP 8-SOP
• Manufacturer: Freescale Semiconductor
• Series: MPVZ5010r
• Type: Gager

Specifications of MPVZ5010G6T1

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI, 10 kPa
• Port Size: Male, 0.22" (5.588mm) Tube
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOP
• Output Voltage Range: 0.2 to 4.7V
• Pressure Range: 0 to 10KPa
• Overload Pressure (max): 40KPa
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: SMT
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Output Voltage: 4.475 V to 4.925 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPVZ5010G
4
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
Frame
Lead
The performance over temperature is achieved by
Figure 2
The MPVZ5010G series pressure sensor operating
Wire Bond
Figure 2. Cross-Sectional Diagram SOP
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
illustrates the Differential or Gauge configuration
Differential Sensing
Fluoro Silicone
Gel Die Coat
Element
(not to scale)
P1
P2
5.0
4.0
3.0
2.0
1.0
0
0
Die
Figure 4. Output versus Pressure Differential
Transfer Function (kPa):
V
V
TEMP = 0 to 85°C
out
S
= 5.0 Vdc
= V
MAX
S
× (0.09 × P + 0.04) ± 5.0% V
2.0
Steel Cap
Stainless
Differential Pressure (kPa)
Die Bond
Thermoplastic
4.0
Case
MIN
than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range.
FSS
6.0
Figure 3
Figure 4
Figure 3. Recommended Power Supply Decoupling
1.0 µF
(For additional output filtering, please refer to
TYPICAL
shows the recommended decoupling circuit for
shows the sensor output signal relative to
8.0
Application Note AN1646.)
0.01 µF
and Output Filtering
10
V
s
+5 V
GND
IPS
Freescale Semiconductor
V
out
Figure
470 pF
OUTPUT
Sensors
3. The