MPVZ5010G6U Freescale Semiconductor, MPVZ5010G6U Datasheet - Page 6

• Manufacturer Part Number: MPVZ5010G6U
• Description: PRESSURE SENSOR SS CAP 8-SOP
• Manufacturer: Freescale Semiconductor
• Series: MPVZ5010r
• Type: Gager

Specifications of MPVZ5010G6U

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI, 10 kPa
• Port Size: Male, 0.22" (5.588mm) Tube
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOP
• Output Voltage Range: 0.2 to 4.7V
• Pressure Range: 0 to 10KPa
• Overload Pressure (max): 40KPa
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: SMT
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Supply Current: 10 mA
• Output Voltage: 4.475 V to 4.925 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPVZ5010G
6
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media. The MPX pressure sensor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MPVZ5010GW6U
MPVZ5010GW7U
MPVZ5010G6U/T1
MPVZ5010G7U
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Part Number
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Figure 5. SOP Footprint (Case 482)
0.100 TYP 8X
2.54
Case Type
0.660
16.76
482B-03
1735-01
1560-02
482-01
is designed to operate with positive differential pressure
applied, P1 > P2.
table below:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Vertical Port Attached
Vertical Port Attached
Stainless Steel Cap
Stainless Steel Cap
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Side Identifier
Pressure (P1)
Freescale Semiconductor
Sensors