MPXAZ6115A7U Freescale Semiconductor, MPXAZ6115A7U Datasheet - Page 6
![PRESSURE SENSOR ABSOLUTE 8-DIP](/photos/31/39/313918/8pin_pdip_sml.jpg)
MPXAZ6115A7U
Manufacturer Part Number
MPXAZ6115A7U
Description
PRESSURE SENSOR ABSOLUTE 8-DIP
Manufacturer
Freescale Semiconductor
Series
MPXAZ6115r
Type
Absoluter
Datasheet
1.MPXHZ6115A6U.pdf
(15 pages)
Specifications of MPXAZ6115A7U
Pressure Type
Absolute
Operating Pressure
2.2 ~ 16.7 PSI
Output
0 ~ 4.8V
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.560", 14.22mm), Top Port
Output Voltage Range
0.2 to 4.8V
Pressure Range
15 to 115KPa
Overload Pressure (max)
400KPa
Mounting
Through Hole
Pin Count
8
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Package Type
PDIP
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5 V
Output Voltage
4.633 V to 4.768 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MPXAZ6115A
6
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
0.060 TYP 8X
1.52
Figure 6. SSOP Footprint (Case 1317 and 1317A)
Figure 5. SOP Footprint (Case 482 and 482A)
0.150
3.81
0.050
1.27
TYP
0.100 TYP 8X
2.54
0.660
16.76
0.053 TYP 8X
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
1.35
0.027 TYP 8X
0.69
0.387
9.83
inch
mm
inch
mm
0.100 TYP
2.54
0.300
7.62
Freescale Semiconductor
Sensors