MPXAZ6115A7U Freescale Semiconductor, MPXAZ6115A7U Datasheet - Page 6

• Manufacturer Part Number: MPXAZ6115A7U
• Description: PRESSURE SENSOR ABSOLUTE 8-DIP
• Manufacturer: Freescale Semiconductor
• Series: MPXAZ6115r
• Type: Absoluter

Specifications of MPXAZ6115A7U

• Pressure Type: Absolute
• Operating Pressure: 2.2 ~ 16.7 PSI
• Output: 0 ~ 4.8V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.560", 14.22mm), Top Port
• Output Voltage Range: 0.2 to 4.8V
• Pressure Range: 15 to 115KPa
• Overload Pressure (max): 400KPa
• Mounting: Through Hole
• Pin Count: 8
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: PDIP
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 5 V
• Output Voltage: 4.633 V to 4.768 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXAZ6115A
6
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
0.060 TYP 8X
1.52
Figure 6. SSOP Footprint (Case 1317 and 1317A)
Figure 5. SOP Footprint (Case 482 and 482A)
0.150
3.81
0.050
1.27
TYP
0.100 TYP 8X
2.54
0.660
16.76
0.053 TYP 8X
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
1.35
0.027 TYP 8X
0.69
0.387
9.83
inch
mm
inch
mm
0.100 TYP
2.54
0.300
7.62
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