PACDN1404CG ON Semiconductor, PACDN1404CG Datasheet
PACDN1404CG
Specifications of PACDN1404CG
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PACDN1404CG Summary of contents
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Features • Four or eight transient voltage suppressors in a single package • In-system electrostatic discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard • Compact Chip Scale Package (CSP 0.65mm pitch format saves board ...
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PACDN1404/1408 Electrical Schematic Rev.3 | Page www.onsemi.com ...
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... Notes: 1) These drawings are not to scale. Ordering Information Bumps Package 6 10 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. PART NUMBERING INFORMATION Ordering Part Number CSP PACDN1404CG CSP PACDN1408CG Rev Page www.onsemi.com PACDN1404/1408 1 Part Marking D14 DN1408 ...
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PACDN1404/1408 Specifications PARAMETER Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER V Reverse Standoff Voltage REV I Leakage Current LEAK V Signal Clamp Voltage SIG Positive Clamp Negative Clamp V In-system ESD Withstand ...
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Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner ...
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PACDN1404/1408 Mechanical Details The PACDN1404/1408 devices are packaged in custom Chip Scale Packages (CSP). PACDN1404 6-bump CSP Mechanical Specifications The PACDN1404 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Custom CSP ...
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CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) PACDN1404 1.804 X 1.154 X 0.644 POCKET SIZE (mm) TAPE WIDTH 1.98 X 1.32 X 0.91 8mm + + Figure 3. Tape ...
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PACDN1404/1408 Mechanical Details (cont’d) PACDN1408 10-bump CSP Mechanical Specifications The PACDN1408 devices are packaged in a 10-bump custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Custom CSP Package Bumps Millimeters Dim Min Nom Max 1.109 1.154 1.199 ...
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CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) PACDN1408 3.104 X 1.154 X 0.644 POCKET SIZE (mm) TAPE WIDTH 3.28 X 1. Figure 4. Tape and ...
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... Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi ...