PACDN1404CG ON Semiconductor, PACDN1404CG Datasheet - Page 6

• Manufacturer Part Number: PACDN1404CG
• Description: 4 CH. ESD PROTECTION WLCSP
• Manufacturer: ON Semiconductor

Specifications of PACDN1404CG

• Voltage - Reverse Standoff (typ): 5.5V
• Voltage - Breakdown: 5.6V
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: 6-WLCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACDN1404/1408
Mechanical Details
The PACDN1404/1408 devices are packaged in custom Chip Scale Packages (CSP).
PACDN1404 6-bump CSP Mechanical Specifications
The PACDN1404 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are
presented below.
# per tape and
Dim
A1
A2
B1
B2
B3
C1
C2
D1
D2
Package
Bumps
reel
1.109 1.154 1.199 0.0437 0.0454 0.0472
1.759 1.804 1.849 0.0693 0.0710 0.0728
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.600 0.644 0.687 0.0236 0.0253 0.0271
0.356 0.381 0.406 0.0140 0.0150 0.0160
Min
PACKAGE DIMENSIONS
Controlling dimension: millimeters
Millimeters
Nom
Max
Custom CSP
3500 pieces
Min
6
Inches
Nom
Rev.3 | Page 6 of 10 | www.onsemi.com
Max
PACDN1404 6-bump Chip Scale Package
0.35 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
B1
Package Dimensions for
DIMENSIONS IN MILLIMETERS
3
2
1
BOTTOM VIEW
B
A1
A
C1
D1
D2
VIEW
SIDE