PACDN1404CG ON Semiconductor, PACDN1404CG Datasheet - Page 6
PACDN1404CG
Manufacturer Part Number
PACDN1404CG
Description
4 CH. ESD PROTECTION WLCSP
Manufacturer
ON Semiconductor
Datasheet
1.PACDN1404CG.pdf
(10 pages)
Specifications of PACDN1404CG
Voltage - Reverse Standoff (typ)
5.5V
Voltage - Breakdown
5.6V
Polarization
4 Channel Array - Unidirectional
Mounting Type
Surface Mount
Package / Case
6-WLCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PACDN1404CG
Manufacturer:
XILINX
Quantity:
3
PACDN1404/1408
Mechanical Details
The PACDN1404/1408 devices are packaged in custom Chip Scale Packages (CSP).
PACDN1404 6-bump CSP Mechanical Specifications
The PACDN1404 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are
presented below.
# per tape and
Dim
A1
A2
B1
B2
B3
C1
C2
D1
D2
Package
Bumps
reel
1.109 1.154 1.199 0.0437 0.0454 0.0472
1.759 1.804 1.849 0.0693 0.0710 0.0728
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.600 0.644 0.687 0.0236 0.0253 0.0271
0.356 0.381 0.406 0.0140 0.0150 0.0160
Min
PACKAGE DIMENSIONS
Controlling dimension: millimeters
Millimeters
Nom
Max
Custom CSP
3500 pieces
Min
6
Inches
Nom
Rev.3 | Page 6 of 10 | www.onsemi.com
Max
PACDN1404 6-bump Chip Scale Package
0.35 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
B1
Package Dimensions for
DIMENSIONS IN MILLIMETERS
3
2
1
BOTTOM VIEW
B
A1
A
C1
D1
D2
VIEW
SIDE