TBU-CA065-100-WH Bourns Inc., TBU-CA065-100-WH Datasheet - Page 4

• Manufacturer Part Number: TBU-CA065-100-WH
• Description: SURGE SUPP TBU 100MA 650VIMP SMD
• Manufacturer: Bourns Inc.
• Series: TBU-CAr

Specifications of TBU-CA065-100-WH

• Package / Case: SMD 6.50mm x 4.00mm
• Voltage - Working: 300V
• Voltage - Clamping: 650V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: General Purpose
• Voltage Rating: 650 V
• Current Rating: 100 mA
• Operating Temperature Range: - 40 C to + 125 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: TBU-CA065-100-WHTR

TBU
suggested layout should use Non-Solder Mask Defi ne (NSMD).
The recommended stencil thickness is 0.10-0.12 mm (.004-
.005 in.) with a stencil opening size 0.025 mm (.0010 in.) less
than the device pad size. As when heat sinking any power
device, it is recommended that wherever possible, extra PCB
copper area is allowed. For minimum parasitic capacitance, do
not allow any signal, ground or power signals beneath any of
the pads of the device.
Dark grey areas show added PCB copper area for better
thermal resistance.
Product Dimensions
Recommended Pad Layout
®
TBU-CA Series - TBU
protectors have matte-tin termination fi nish. The
(.157 ± .004)
4.00 ± 0.10
3
DIMENSIONS:
2
PIN 1 & BACKSIDE CHAMFER
(.256 ± .004)
6.50 ± 0.10
1
®
High-Speed Protectors
(INCHES)
MM
(.000 - .002)
0.00 - 0.05
(.033 ± .002)
0.85 ± 0.05
(.012)
0.30
Thermal Resistance vs Additional PCB Cu Area
(.012)
0.30
(.134)
3.40
Customers should verify actual device performance in their specifi c applications.
(.073)
1.85
120
100
Pad #
80
60
40
20
0
1
2
3
0
(.028)
0.70
Pad Designation
0.2
0.4
0.6
(.031)
Added Cu Area (Sq. In.)
Specifi cations are subject to change without notice.
0.80
Line In/Out
Line Out/In
(.028)
Pin Out
0.70
0.8
NU
1.0
(.073)
1.85
C
1.2
(.010)
0.25
1.4
PIN 1
1.6
1.8
2.0