XC3S1600E-4FG400I Xilinx Inc, XC3S1600E-4FG400I Datasheet - Page 155
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XC3S1600E-4FG400I
Manufacturer Part Number
XC3S1600E-4FG400I
Description
IC FPGA SPARTAN 3E 400FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S1600E-4FG400I
Number Of Logic Elements/cells
33192
Number Of Labs/clbs
3688
Total Ram Bits
663552
Number Of I /o
304
Number Of Gates
1600000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
400-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Table 117: Timing for the Slave Parallel Configuration Mode (Continued)
DS312-3 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
3.
Hold Times
T
T
T
Clock Timing
T
T
F
SMCCD
SMCCCS
SMWCC
CCH
CCL
CCPAR
Symbol
The numbers in this table are based on the operating conditions set forth in
In the Slave Parallel mode, it is necessary to use the BUSY pin when the CCLK frequency exceeds this maximum specification.
Some Xilinx documents refer to Parallel modes as “SelectMAP” modes.
R
The time from the active edge of the CCLK pin to the point when data is last
held at the D0-D7 pins
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the CSO_B pin
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the RDWR_B pin
The High pulse width at the CCLK input pin
The Low pulse width at the CCLK input pin
Frequency of the clock
signal at the CCLK input
pin
No bitstream
compression
With bitstream compression
Description
www.xilinx.com
Not using the BUSY pin
Using the BUSY pin
Table
77.
DC and Switching Characteristics
(2)
All Speed Grades
Min
1.0
0
0
5
5
0
0
0
Max
50
66
20
-
-
-
-
-
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
155
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