EFM32G200F16 Energy Micro, EFM32G200F16 Datasheet - Page 8

• Manufacturer Part Number: EFM32G200F16
• Description: MCU 32BIT 16KB FLASH 32-QFN
• Manufacturer: Energy Micro
• Series: Geckor

Specifications of EFM32G200F16

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.8 V
• Data Converters: A/D 4x12b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad
• Processor Series: EFM32G200
• Core: ARM Cortex-M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 2
• Operating Supply Voltage: 1.8 V to 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

3 Electrical Characteristics
3.1 Test Conditions
3.1.1 Typical Values
3.1.2 Minimum and Maximum Values
3.2 Absolute Maximum Ratings
3.3 General Operating Conditions
3.3.1 General Operating Conditions
2010-12-17 - d0003_Rev1.20
The typical data are based on T
lation and/or technology characterisation unless otherwise specified.
The minimum and maximum values represent the worst conditions of ambient temperature, supply volt-
age and frequencies, as defined in Table 3.2 (p. 8) , by simulation and/or technology characterisa-
tion unless otherwise specified.
The absolute maximum ratings are stress ratings, and functional operation under such conditions are
not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 8) may affect the device reliability
or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.
8) .
Table 3.1. Absolute Maximum Ratings
1
ibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data re-
tention for different temperatures.
Table 3.2. General Operating Conditions
Based on programmed devices tested for 10000 hours at 150°C. Storage temperature affects retention of preprogrammed cal-
Symbol
T
T
V
V
Symbol
T
V
f
f
APB
AHB
STG
S
AMB
DDMAX
IOPIN
DDOP
Parameter
Storage temperature range
Maximum soldering tem-
perature
External main supply volt-
age
Voltage on any I/O pin
Parameter
Ambient temperature range
Operating supply voltage
Internal APB clock frequency
Internal AHB clock frequency
AMB
=25°C and V
Condition
Latest IPC/JEDEC J-STD-020
Standard
...the world's most energy friendly microcontrollers
8
DD
=3.0 V, as defined in Table 3.2 (p. 8) , by simu-
Min
-0.3
-40
Min
0
-40
1.8
Typ
www.energymicro.com
Typ
Max
V
Max
DD
150
+0.3 V
260 °C
3.8 V
3.8 V
85 °C
32 MHz
32 MHz
1
Unit
°C
Unit