EFM32G200F64 Energy Micro, EFM32G200F64 Datasheet - Page 54

• Manufacturer Part Number: EFM32G200F64
• Description: MCU 32BIT 64KB FLASH 32-QFN
• Manufacturer: Energy Micro
• Series: Geckor

Specifications of EFM32G200F64

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.8 V
• Data Converters: A/D 4x12b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad
• Processor Series: EFM32G200
• Core: ARM Cortex-M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 2
• Operating Supply Voltage: 1.8 V to 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

7 Revision History
7.1 Revision 1.20
7.2 Revision 1.11
7.3 Revision 1.10
2010-12-17 - d0003_Rev1.20
December 17th, 2010
Increased max storage temperature.
Added data for <150°C and <70°C on Flash data retention.
Changed latch-up sensitivity test description.
Added IO leakage current
Added Flash current consumption
Updated HFRCO data
Updated LFRCO data
Added graph for ADC Absolute Offset over temperature
Added graph for ADC Temperature sensor readout
November 17th, 2010
Corrected maximum DAC clock speed for continuous mode.
Added DAC sample-hold mode voltage drift rate.
Added pulse widths detected by the HFXO glitch detector.
Added power sequencing information to Power Management section.
September 13th, 2010
Added typical values for R
Added two conditions for DAC clock frequency; one for sample/hold and one for sample/off.
Added RoHS information and specified leadframe/solderballs material.
Added Serial Bootloader to feature list and system summary.
Updated ADC characterization data.
Updated DAC characterization data.
Updated RCO characterization data.
Updated ACMP characterization data.
Updated VCMP characterization data.
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