EFM32G230F64 Energy Micro, EFM32G230F64 Datasheet - Page 61

• Manufacturer Part Number: EFM32G230F64
• Description: MCU 32BIT 64KB FLASH 64-QFN
• Manufacturer: Energy Micro
• Series: Geckor

Specifications of EFM32G230F64

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.8 V
• Data Converters: A/D 8x12b, D/A 2x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN, Exposed Pad
• Processor Series: EFM32G230
• Core: ARM Cortex-M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

2010-12-17 - d0005_Rev1.20
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
3. Electrical Characteristics ............................................................................................................................. 8
4. Pinout and Package ................................................................................................................................. 46
5. PCB Layout and Soldering ........................................................................................................................ 53
6. Chip Marking, Revision and Errata .............................................................................................................. 55
7. Revision History ...................................................................................................................................... 56
A. Disclaimer and Trademarks ....................................................................................................................... 59
B. Contact Information ................................................................................................................................. 60
1.1. Block Diagram ............................................................................................................................... 2
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3.1. Test Conditions .............................................................................................................................. 8
3.2. Absolute Maximum Ratings .............................................................................................................. 8
3.3. General Operating Conditions ........................................................................................................... 8
3.4. Current Consumption ..................................................................................................................... 10
3.5. Transition between Energy Modes .................................................................................................... 17
3.6. Power Management ....................................................................................................................... 17
3.7. Flash .......................................................................................................................................... 18
3.8. General Purpose Input Output ......................................................................................................... 19
3.9. Oscillators .................................................................................................................................... 26
3.10. Analog Digital Converter (ADC) ...................................................................................................... 31
3.11. Digital Analog Converter (DAC) ...................................................................................................... 40
3.12. Analog Comparator (ACMP) .......................................................................................................... 42
3.13. Voltage Comparator (VCMP) ......................................................................................................... 44
3.14. Digital Peripherals ....................................................................................................................... 44
4.1. Pinout ......................................................................................................................................... 46
4.2. Alternate functionality pinout ............................................................................................................ 48
4.3. GPIO pinout overview .................................................................................................................... 51
4.4. QFN64 Package ........................................................................................................................... 51
5.1. Recommended PCB Layout ............................................................................................................ 53
5.2. Soldering Information ..................................................................................................................... 54
6.1. Chip Marking ................................................................................................................................ 55
6.2. Revision ...................................................................................................................................... 55
6.3. Errata ......................................................................................................................................... 55
7.1. Revision 1.20 ............................................................................................................................... 56
7.2. Revision 1.11 ............................................................................................................................... 56
7.3. Revision 1.10 ............................................................................................................................... 56
7.4. Revision 1.00 ............................................................................................................................... 57
7.5. Revision 0.85 ............................................................................................................................... 57
7.6. Revision 0.84 ............................................................................................................................... 57
7.7. Revision 0.83 ............................................................................................................................... 57
7.8. Revision 0.82 ............................................................................................................................... 57
7.9. Revision 0.81 ............................................................................................................................... 57
7.10. Revision 0.80 .............................................................................................................................. 58
A.1. Disclaimer ................................................................................................................................... 59
A.2. Trademark Information ................................................................................................................... 59
B.1. Energy Micro Corporate Headquarters .............................................................................................. 60
B.2. Global Contacts ............................................................................................................................ 60
...the world's most energy friendly microcontrollers
61
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