TFDU4101-TR3 Vishay, TFDU4101-TR3 Datasheet - Page 9

• Manufacturer Part Number: TFDU4101-TR3
• Description: Infrared Transceivers SIR 115.2 kbits/s
• Manufacturer: Vishay
• Type: Serialr

Specifications of TFDU4101-TR3

• Data Transmission Rate: 2.4 Kbits/s to 115.2 Kbits/s
• Input Current: 10 mA
• Mounting Style: SMD/SMT
• Power Dissipation: 250 mW
• Wavelength: 900 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 1 m
• Radiant Intensity: 65 mW/sr
• Half Intensity Angle Degrees: 24 deg
• Pulse Width: 2.2 us
• Maximum Rise Time: 100 ns, 300 ns
• Maximum Fall Time: 100 ns, 300 ns
• Operating Voltage: 2.4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Dimensions: 9.7 mm x 4.7 mm x 4 mm
• Data Rate Max: 115.2Kbps
• Data Transmission Distance: 1m
• Peak Wavelength: 900nm
• Supply Current: 90µA
• Supply Voltage Range: 2.4V To 5.5V
• Operating Temperature Range: -30°C To +85°C
• Msl: MSL 4 - 72 Hours
• Package: 8Ultra Small Profile
• Maximum Data Rate: 0.1152 Mbps
• Operating Supply Voltage: 2.4 to 5.5 V
• Operating Temperature Max: 85°C
• Rohs Compliant: Yes
• Current I Led Dc: 80mA
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 1m
• Operating Temperature: -30°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 9.7mm x 4.7mm x 4mm
• Standards: IrPHY 1.0
• Supply Voltage: 2.4 V ~ 5.5 V
• Svhc: No SVHC (20-Jun-2011)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU4101 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9)
Cu, there are two standard reflow profiles: Ramp-
Soak-Spike (RSS) and Ramp-To-Spike (RTS). The
Ramp-Soak-Spike profile was developed primarily for
reflow ovens heated by infrared radiation.
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown
below in figure 5 and 6 are VISHAY's recommended
profiles for use with the TFDU4101 transceivers. For
more details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Document Number 81288
Rev. 1.2, 04-Dec-07
Figure 4. Recommended Solder Profile for Sn/Pb Soldering
With
Storage
The storage and drying processes for all VISHAY
transceivers
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
(TFDUxxxx
Vishay Semiconductors
and
TFDU4101
TFBSxxx)
www.vishay.com
are
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