A2F-EVAL-KIT Actel, A2F-EVAL-KIT Datasheet - Page 3

MCU, MPU & DSP Development Tools Smart Fusion Eval Kit

A2F-EVAL-KIT

Manufacturer Part Number
A2F-EVAL-KIT
Description
MCU, MPU & DSP Development Tools Smart Fusion Eval Kit
Manufacturer
Actel
Datasheet

Specifications of A2F-EVAL-KIT

Processor To Be Evaluated
A2F200M3F-FGG484
Data Bus Width
32 bit
Interface Type
Ethernet, USB, SPI
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
A2F-EVAL-KIT
Manufacturer:
ACT
Quantity:
139
Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your
best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart
from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally-
friendly data centers and industrial controls. Take your designs to 30,000 feet or even millions of miles into space. Only
Actel can meet the power, size, cost and reliability targets that reduce time-to-market and enable long-term profitability.
Now, more than ever, power matters.
Please refer to www.actel.com and appropriate product datasheets for the latest device information and valid ordering codes. More information regarding
previous generations of flash and antifuse FPGAs is also available on Actel’s website.
Table of Contents
IGLOO
IGLOO nano
IGLOO PLUS
ProASIC
ProASIC3 nano
ProASIC3L
SmartFusion
Fusion
IGLOO and ProASIC3 I/O Table
FPGA Packages
Design Tools
Development Kits
Programmers
Pigeon Point Systems
®
/e
®
3/E
• Intelligent Mixed-Signal FPGAs
• Mixed-Signal FPGAs
• IGLOO and ProASIC3 I/O Counts
• Package Dimensions
• Design Environment for Actel Flash Devices
• Starter, Evaluation and Demonstration Kits
• FlashPro3 and Silicon Sculptor 3 Programmers
• Solutions Partner
• Low Power
• Small Package Footprint
• High Logic Density
• Low Power
• Small Package Footprint
• Low Power
• Small Package Footprint
• High I/O-to-Logic Ratio
• High Logic Density
• High Performance
• Low Cost
• Small Package Footprint
• High Performance
• Low Cost
• Low Power
• High Logic Density
• High Performance
• Low Cost
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