ENW-89818C2JF Panasonic, ENW-89818C2JF Datasheet - Page 23

Bluetooth / 802.15.1 Modules & Development Tools CC2560 HCI module no antenna

ENW-89818C2JF

Manufacturer Part Number
ENW-89818C2JF
Description
Bluetooth / 802.15.1 Modules & Development Tools CC2560 HCI module no antenna
Manufacturer
Panasonic
Datasheet

Specifications of ENW-89818C2JF

Interface Type
I2C, SPI, UART
Data Rate
4 Mbps
Operating Voltage
3.3 V
Board Size
6.5 mm x 9 mm
Operating Temperature Range
- 20 C to + 70 C
Output Power
10.5 dBm
Technology/ Type
HCI Module
Processor Series
CC2560
For Use With/related Products
EVAL-PAN1315
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
CLASSIFICATION
SUBJECT
CUSTOMER’S CODE
PAN1315
13.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
13.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
13.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Reflow permissible cycle:
Opposite side reflow is prohibited due to module weight.
Temp
Temp
SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
150°C – 190°C
.[°C]
.[°C]
150 ±10°C
CLASS 1 or 2 BLUETOOTH MODULE
230°C -250°C max.
235°C max.
PRODUCT SPECIFICATION
220 ±5°C
2
PANASONIC’S CODE
ENW89818C2JF
200°C
220°C
90 ±30s
90 ±30s
30 +20/-10s
30 +20/-10s
No.
DS-1315-2400-102
PAGE
DATE
10 ±1s
www.pedeu.pansonic.de
Time [s]
Time [s]
23.05.2011
23 of 41
REV.
1.03

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