TQP3M9009-PCB-IF TriQuint, TQP3M9009-PCB-IF Datasheet - Page 9

RF Amplifier Eval Bd .05-.5GHz

TQP3M9009-PCB-IF

Manufacturer Part Number
TQP3M9009-PCB-IF
Description
RF Amplifier Eval Bd .05-.5GHz
Manufacturer
TriQuint
Type
High Linearity Amplifierr
Datasheet

Specifications of TQP3M9009-PCB-IF

Bandwidth
1.9 GHz
Mounting Style
SMD/SMT
Number Of Channels
1
Operating Frequency
50 MHz to 500 MHz
P1db
22 dBm
Noise Figure
1.3 dB
Operating Supply Voltage
4.75 V to 5.25 V
Supply Current
125 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Package / Case
SOT-89
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1075457
TQP3M9009
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. RF trace width depends upon the PC board material and construction.
4. Use 1 oz. Copper minimum.
Advanced Data Sheet: Rev B 03/29/10
© 2009 TriQuint Semiconductor, Inc.
High Linearity LNA Gain Block
Mechanical Information
Package Information and Dimensions
This
compliant. The plating material on the
leads is NiPdAu. It is compatible with
both lead-free
reflow
(maximum 245 °C reflow temperature)
soldering processes.
The component will be marked with a
“3M9009”
alphanumeric lot code on the top
surface of package. The “Y” represents
the last digit of the year the part was
manufactured; the “XXX” is an auto
generated number.
have a final plated thru diameter of .25 mm (.010”).
package
temperature)
designator
is
(maximum 260 °C
lead-free/RoHS-
and
with
lead
an
3M9009
YXXX
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