BGA 711L7 E6327 Infineon Technologies, BGA 711L7 E6327 Datasheet
BGA 711L7 E6327
Specifications of BGA 711L7 E6327
Related parts for BGA 711L7 E6327
BGA 711L7 E6327 Summary of contents
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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BGA711L7 Revision History: 2009-05-27, V3.2 Previous Version: 2008-11-05, V3.1 Page Subjects (major changes since last revision) 7 Updated DC Characteristics (added limits) 9, 10, 11 Updated footnotes 18 Updated value Application Circuit Schematic for band II Data ...
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Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Description The BGA711L7 is a low current single-band low noise amplifier MMIC for UMTS bands I, IV and X. The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green ...
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Electrical Characteristics 2.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings Parameter Symbol V Supply voltage CC I Supply current CC V Pin voltage PIN V Pin voltage RF Input Pin RFIN P RF input power RFIN T Junction ...
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DC Characteristics Table 4 DC Characteristics, Parameter Symbol V Supply voltage CC I Supply current high gain CCHG mode I Supply current low gain CCLG mode I Supply current standby CCOFF mode V Logic level high HI V Logic ...
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Supply current and Power gain characteristics; Supply current and Power gain high gain mode versus reference resistor R reference resistor; low gain mode supply current is independent of reference resistor Supply Current = ...
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Measured RF Characteristics UMTS Bands (with reference resistor) 2.9 Measured RF Characteristics UMTS Bands (with reference resistor) Table 7 Typical Characteristics 2100 MHz Band T Parameter Pass band range band ...
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Measured RF Characteristics UMTS Bands (without ref. resistor) Table 8 Typical Characteristics 2100 MHz Band T Parameter Pass band range band Pass band range band IV Current consumption Gain 1) Reverse ...
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Measured RF Characteristics UMTS Band II (with reference resistor) Table 9 Typical Characteristics 1900 MHz Band T Parameter Pass band range band II Current consumption Gain 1) Reverse Isolation Noise figure 1) Input return loss 1) Output return loss ...
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Measured Performance High Band (Band I) High Gain Mode vs. Frequency ° Power Gain | = ...
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Measured Performance High Band (Band I) High Gain Mode vs. Temperature NF f Noise Figure = 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 2.11 2.12 2.13 2.14 Frequency [GHz] 2.13 Measured Performance High Band (Band ...
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NF T Noise Figure = 1.8 1.6 1.4 1.2 1 0.8 0.6 −40 − [°C] A 2.14 Measured Performance High Band (Band I) Low Gain Mode vs. Frequency ...
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Matching | | = −5 −10 −15 −20 −25 −30 2.11 2.12 2.13 2.14 Frequency [GHz Noise Figure = ...
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Measured Performance High Band (Band I) Low Gain Mode vs. Temperature 2.15 Measured Performance High Band (Band I) Low Gain Mode vs. Temperature 2 2 ...
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Application Circuit and Block Diagram 3.1 UMTS bands I, IV and X Application Circuit Schematic C1 10pF RFIN 2100 MHz L1 2nH C2 100 2 2 ...
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UMTS band II Application Circuit Schematic C1 10pF RFIN 1 1900 MHz L1 RFIN 2.7nH C2 100pF 2 VEN 2 VGS Figure 3 Application circuit ...
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Application Board Figure 4 Application board layout on 3-layer FR4. Top layer thickness: 0.2 mm, bottom layer thickness: 0.8 mm, 17 µm Cu metallization, gold plated. Board size Figure 5 Cross-section view of application board ...
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Figure 6 Detail of application board layout Note: In order to achieve the same performance as given in this datasheet please follow the suggested PCB-layout as closely as possible. The position of the GND vias is critical for RF performance. ...
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Physical Characteristics 4.1 Package Dimensions 1.4 0.3 0.3 0.3 Copper Solder mask Figure 7 Recommended footprint and stencil layout for the TSLP-7-1 package Top view Pin 1 marking 1) Dimension applies to plated terminal Figure 8 ...
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Figure 10 Marking Layout Data Sheet BGA711L7 - Low Power Single-Band UMTS LNA 22 Physical Characteristics Package Dimensions V3.2, 2009-05-27 ...
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... Published by Infineon Technologies AG ...