BGA 758L7 E6327 Infineon Technologies, BGA 758L7 E6327 Datasheet - Page 5
BGA 758L7 E6327
Manufacturer Part Number
BGA 758L7 E6327
Description
RF Amplifier RF SILICON MMIC
Manufacturer
Infineon Technologies
Type
Silicon Germanium MMICr
Datasheet
1.BGA_758L7_E6327.pdf
(16 pages)
Specifications of BGA 758L7 E6327
Mounting Style
SMD/SMT
Operating Frequency
5 GHz to 6 GHz
P1db
- 3.5 dBm
Noise Figure
1.3 dB
Operating Supply Voltage
4 V
Supply Current
7 mA
Maximum Power Dissipation
48 mW
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Package / Case
TSLP-7-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BGA758L7E6327XT
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Preliminary Data Sheet
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Cross-section of Application Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package Outline TSLP-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Footprint TSLP-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
Revision 1.0, 2010-02-22
List of Figures
BGA758L7