TGF2021-04 TriQuint, TGF2021-04 Datasheet - Page 7

• Manufacturer Part Number: TGF2021-04
• Description: RF GaAs DC-12GHz 4mm Pwr pHEMT (0.35um)
• Manufacturer: TriQuint

Specifications of TGF2021-04

• Mounting Style: SMD/SMT
• Forward Transconductance Gfs (max / Min): 1.5 S
• Gate-source Breakdown Voltage: - 8 V
• Package / Case: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1077214

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during
handing, assembly and test.
TriQuint Semiconductor: Phone [phone] Fax [phone] [e-mail] www.triquint.com
GATE
1.297 [0.051]
1.019 [0.040]
0.763 [0.030]
0.507 [0.020]
0.251 [0.010]
0.000 [0.000]
Units: millimeters (inches)
Bond pads #1-4:
Bond pads # 5-8: (Drain) 0.090 x 0.090 (0.004 x 0.004)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Mechanical Drawing
(Gate)
3
1
4
2
N E
0.090 x 0.090 (0.004 x 0.004)
5
6
7
8
DRAIN
Product Datasheet
TGF2021-04
August 7, 2007
Rev -
7