BD63801EFV-E2 Rohm Semiconductor, BD63801EFV-E2 Datasheet - Page 4

Motor / Motion / Ignition Controllers & Drivers Stepping Motor Driver 36V

BD63801EFV-E2

Manufacturer Part Number
BD63801EFV-E2
Description
Motor / Motion / Ignition Controllers & Drivers Stepping Motor Driver 36V
Manufacturer
Rohm Semiconductor
Type
Bipolar Stepping Motor Driverr
Datasheet

Specifications of BD63801EFV-E2

Product
Stepper Motor Controllers / Drivers
Operating Supply Voltage
19 V to 28 V
Supply Current
2.7 mA
Mounting Style
SMD/SMT
Package / Case
HTSSOP-B24
Operating Temperature
- 25 C to + 75 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BD63801EFV-E2
Manufacturer:
ROHM Semiconductor
Quantity:
1 975
○Operation Notes
(1)
(2)
(3)
(4)
(5) Thermal design
(6) Actions in strong electromagnetic field
(7) ASO
(8) Thermal shutdown circuit
(9) Ground Wiring Pattern
(10) Mounting errors and Inter-pin short
(11) TEST pin
Absolute maximum ratings
Power supply lines
GND potential
Metal on the backside (Define the side where product markings are printed as front)
Be sure to connect TEST pin to GND.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
The potential of GND pin must be minimum potential in all operating conditions.
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
When attaching to a printed circuit board, pay attention to the direction of the IC and displacement.
Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short-
circuits which can be caused by foreign matter entering between pins.
REV. A
4/4

Related parts for BD63801EFV-E2