A3PN030-ZQNG48 Actel, A3PN030-ZQNG48 Datasheet - Page 68
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A3PN030-ZQNG48
Manufacturer Part Number
A3PN030-ZQNG48
Description
FPGA - Field Programmable Gate Array 30K System Gates ProASIC3 nano
Manufacturer
Actel
Datasheet
1.A3PN030-ZVQG100.pdf
(106 pages)
Specifications of A3PN030-ZQNG48
Processor Series
A3PN030
Core
IP Core
Number Of Macrocells
256
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
34
Supply Voltage (max)
3.3 V
Supply Current
2 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 20 C
Development Tools By Supplier
AGLN-Nano-Kit, AGLN-Z-Nano-Kit, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FloasPro 4, FlashPro 3, FlashPro Lite
Mounting Style
SMD/SMT
Supply Voltage (min)
1.5 V
Number Of Gates
30 K
Package / Case
QFN-48
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ProASIC3 nano DC and Switching Characteristics
Table 2-67 • A3PN010 Global Resource
Table 2-68 • A3PN015 Global Resource
2- 54
Parameter Description
t
t
t
t
t
F
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
3. For specific junction temperature and voltage-supply levels, refer to
Parameter Description
t
t
t
t
t
F
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
3. For specific junction temperature and voltage-supply levels, refer to
RCKL
RCKH
RCKMPWH
RCKMPWL
RCKSW
RCKL
RCKH
RCKMPWH
RCKMPWL
RCKSW
RMAX
RMAX
located in a lightly loaded row (single element is connected to the global net).
loaded row (all available flip-flops are connected to the global net in the row).
located in a lightly loaded row (single element is connected to the global net).
loaded row (all available flip-flops are connected to the global net in the row).
Commercial-Case Conditions: T
Commercial-Case Conditions: T
Input LOW Delay for Global Clock
Input HIGH Delay for Global Clock
Minimum Pulse Width HIGH for Global Clock
Minimum Pulse Width LOW for Global Clock
Maximum Skew for Global Clock
Maximum Frequency for Global Clock
Input LOW Delay for Global Clock
Input HIGH Delay for Global Clock
Minimum Pulse Width HIGH for Global Clock
Minimum Pulse Width LOW for Global Clock
Maximum Skew for Global Clock
Maximum Frequency for Global Clock
Global Tree Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be driven
and conditioned internally by the CCC module. For more details on clock conditioning capabilities, refer
to the
minimum and maximum global clock delays within each device. Minimum and maximum delays are
measured with minimum and maximum loading.
Timing Characteristics
"Clock Conditioning Circuits" section on page
J
J
= 70°C, VCC = 1.425 V
= 70°C, VCC = 1.425 V
R e visio n 8
Min.
2-57.
0.62
0.60
Min.
0.66
0.67
Table 2-6 on page 2-5
Table 2-6 on page 2-5
1
–2
Table 2-67
1
–2
Max.
Max.
0.79
0.84
0.22
0.91
0.96
0.29
2
2
Min.
Min.
0.69
0.70
0.75
0.77
to
Table 2-72 on page 2-56
1
1
–1
–1
Max.
Max.
0.90
0.96
for derating values.
for derating values.
0.26
1.04
1.10
0.33
2
2
Min.
Min.
0.81
0.82
0.89
0.90
Std.
1
Std.
1
Max.
Max.
1.06
1.12
0.30
1.22
1.29
0.39
2
2
present
Units
Units
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns