MAX2059ETL+ Maxim Integrated Products, MAX2059ETL+ Datasheet - Page 2

RF Mixer IC DVGA SPI HI LIN igh Linearity, SPI-C

MAX2059ETL+

Manufacturer Part Number
MAX2059ETL+
Description
RF Mixer IC DVGA SPI HI LIN igh Linearity, SPI-C
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX2059ETL+

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
V
RSET1, RSET2......................................................+1.2V to +4.0V
LBBIAS .......................................................(V
LB_EN, DATA,
ATTEN_INA, ATTEN_INB, ATTEN_OUTA, ATTEN_OUTB
AMPIN, Differential LO Input Power ...............................+12dBm
Continuous Power Dissipation (T
DC ELECTRICAL CHARACTERISTICS
(MAX2059 Typical Application Circuit, V
ues are at V
1700MHz to 2200MHz High-Linearity,
SPI-Controlled DVGA with Integrated Loopback Mixer
Note A: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AC ELECTRICAL CHARACTERISTICS
(MAX2059 Typical Application Circuit, V
40MHz ≤ f
95MHz, f
2
Supply Voltage
Total Supply Current
LOGIC INPUTS (DATA, CS, CLK, LB_EN)
Input High Voltage
Input Low Voltage
Input Current with Logic-High
Input Current with Logic-Low
RF Frequency (Note 2)
Small-Signal Gain
Gain Variation vs. Temperature
Output Power
Output Power Flatness
Attenuation Range
Output 3rd-Order Intercept Point
CC
Input Power .................................................................+24dBm
40-Pin TQFN (derated 26.3mW/°C above +70°C) ......2100mW
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
LBOUT
C
PARAMETER
LO
PARAMETER
CC
is the temperature on the exposed paddle of the package.
≤ 100MHz, T
CS, CLK .............................-0.3V to (V
= +5.0V and T
= f
RF
- f
LO
, and T
C
= -40°C to +85°C. Typical values are at V
C
= +25°C, unless otherwise noted.) (Note 1)
A
C
= +70°C)
= +25°C, unless otherwise noted.) (Note 1)
SYMBOL
SYMBOL
P
V
CC
OIP3
CC
I
V
V
I
CC
I
A
OUT
CC
IH
IL
IH
IL
V
= +4.75V to +5.25V, R1 = 1.2kΩ, R2 = 2kΩ, R3 = 2kΩ, T
= +4.75V to +5.25V, digital attenuators set for maximum gain, 1700MHz ≤ f
CC
- 1.5V) to +5.5V
Reference to V
VCCBIAS1, VCCBIAS2, VCCAMP
LB mixer disabled (LB_EN = 1)
LB mixer enabled (LB_EN = 0)
MAX2058
MAX2059
f
All attenuation
settings
P
P
Two tones: f
1851MHz, P
RF
IN
IN
CC
= 1850MHz, T
= 0dBm, f
= 0dBm
+ 0.3V)
RF1
OUT1
RF
CC
CONDITIONS
CONDITIONS
= 1850MHz, f
= 1850MHz, T
, VCCLB, VCCLOGIC,
C
= P
T
T
1800MHz to 2000MHz
2000MHz to 2200MHz
C
C
Operating Temperature Range (Note A) .............-40°C to +85°C
Junction Temperature ......................................................+150°C
θ
θ
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
= +25°C
JC
JA
OUT2
CC
= -40°C to +25°C
= +25°C to +85°C
....................................................................................10°C/W
....................................................................................38°C/W
= 5.0V, P
= +5dBm
RF2
C
= +25°C
=
IN
= 0dBm, f
RF
4.75
1700
MIN
MIN
2.4
700
8.0
8.0
= 1850MHz, P
C
= -40°C to +85°C. Typical val-
-0.024
-0.032
-0.77
TYP
0.01
0.01
189
217
TYP
10.9
10.9
31.8
5.0
56
-2
LO
MAX
5.25
MAX
1200
2200
241
275
13.3
13.3
0.8
= -6dBm, f
RF
≤ 2200MHz,
UNITS
UNITS
dB/°C
MHz
dBm
dBm
mA
µA
µA
dB
dB
dB
V
V
V
LO
=

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