BLM21BD601SH1D Murata, BLM21BD601SH1D Datasheet - Page 76

EMI/RFI Suppressors & Ferrites 0805 600ohms HiSpeed Signal Line Tape

BLM21BD601SH1D

Manufacturer Part Number
BLM21BD601SH1D
Description
EMI/RFI Suppressors & Ferrites 0805 600ohms HiSpeed Signal Line Tape
Manufacturer
Murata
Series
BLM Br
Datasheet

Specifications of BLM21BD601SH1D

Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
600 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.35 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0805 (2012 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.35ohm
Dc Current Rating
200mA
Ferrite Mounting
SMD
Ferrite Case Style
0805 / 2012
Operating Temperature Max
+125°C
Operating Temperature Min
-55°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM21BD601SH1D
Manufacturer:
MURATA
Quantity:
240 000
4
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Mounting Hole
2. Using The Block Type EMIFILr Effectively
(1) How to use effectively
This product effectively prevents undesired radiation and
external noise from going out / entering the circuit by
grounding the high frequency components which cause
noise problems. Therefore, grounding conditions may affect
the performance of the filter and attention should be paid to
the following for effective use.
(2) Self-heating
Though this product has a large rated current, localized self-
heating may be caused depending on soldering conditions.
To avoid this, attention should be paid to the following:
1
74
Block Type EMIFILr Lead Type (Soldering and Mounting)
BNX012H
Mounting holes should be designed as specified below.
(a) Design maximized grounding area in the P.C. board,
(a) Use P.C. board with our recommendation on hole
(b) Solder the terminals to the P.C. board with solder-
(b) Minimize the distance between ground of the P.C.
(c) Insert the terminals into the holes on P.C. board
(d) Don't connect PSG terminal with CG terminal directly.
(c) After installing this product in your product, please
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
and grounding pattern for all the grounding terminals
of the product to be connected. (Please follow the
specified recommendations.)
board and the ground plate of the product.
(Recommended to use through-hole connection
between grounding area both of component side and
bottom side.)
completely.
(See the item 1. TERMINAL LAYOUT)
diameter / land pattern dimensions, mentioned in the
right hand drawing, especially for 4 terminals which
pass current.
cover area at least 90%. Otherwise, excess self-
heating at connection between terminals and P.C.
board may lead to smoke and / or fire of the product
even when operating at rated current.
make sure of the self-heating with the rated current.
Part Number
Component Side
(PSG)
(CG)
2.5 0.1
(CG)
5.0 0.1
7.5 0.1
(CB)
(B)
(CG)
ø1.2
Bulk Type
(1) COMPONENT SIDE VIEW
Recommended Land Pattern
P. C. BOARD PATTERNS
Use a bilateral P.C. board. Insert the BNX into the P.C.board until
the root of the terminal is secured, then solder.
(in mm)
PSG
CG
PSG
CG
CG
2.5
CB
TERMINAL LAYOUT (Bottom figure)
CB
B
3.2
5.0
B
B
CG
3.2
CG
PSG
7.5
CG
PSG
3.2
B
CG
Continued on the following page.
(2) BOTTOM VIEW
CG
PSG : Power supply ground
CG : Load circuit ground
CB
B
B
CB
: Load circuit + Bias
CG
Through holes
PSG
Copper foil pattern
PSG
CB
Copper foil pattern
CG
CG
(in mm)
ø1.2
Shield plate
C50E.pdf
08.8.28

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