BMR4500002/020 Ericsson Power Modules, BMR4500002/020 Datasheet - Page 29

• Manufacturer Part Number: BMR4500002/020
• Description: DC/DC Converters & Regulators 66W 4.5-14V OUT 20A 25.65x12.9x8.22 mm
• Manufacturer: Ericsson Power Modules
• Series: BMR 450r

Specifications of BMR4500002/020

• Output Power: 110 W
• Input Voltage Range: 4.5 V to 14 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 0.6 V to 5.5 V
• Output Current (channel 1): 20 A
• Package / Case Size: 25.65 mm x 12.9 mm x 8.2 mm
• Output Voltage: 0.6 V to 5.5 V
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

E
Soldering Information – Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb and Pb-free
processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 2A is chosen as reference location for the
minimum pin temperature recommendation since this will likely
be the coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
excess of the solder melting temperature, (T
Sn63Pb37) for more than 30 seconds and a peak
temperature of 210°C is recommended to ensure a reliable
solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
Prepared (also subject responsible if other)
EPETSCH
Approved
EAB/FJB/GKF [G.Eriksson]
General reflow process specifications
Average ramp-up (T
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
Minimum pin temperature
Peak product temperature
Average ramp-down (T
Maximum time 25°C to peak
BMR 450 Digital PoL Regulators
Input 4.5-14 V, Output up to 20 A / 100 W
Temperature
T
L
T
PIN
minimum
PRODUCT
PRODUCT
Time in preheat
T
/ soak zone
)
PRODUCT
Time 25°C to peak
L
)
T
T
T
maximum
L
PIN
PRODUCT
SnPb eutectic
3°C/s max
183°C
30 s
210°C
225°C
6°C/s max
6 minutes
Time in
reflow
L
, 183°C for
Checked
See §1
PIN
profile
Pb-free
3°C/s max
221°C
30 s
235°C
260°C
6°C/s max
8 minutes
Pin
) in
Product
profile
Time
Ericsson Internal
PRODUCT SPEC.
No.
5/1301-BMR450 Uen
Date
2008-09-16
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 8B is chosen as reference
location for the maximum (peak) allowed product temperature
(T
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment
and no longer can be considered dry, the modules must be
baked according to J-STD-033.
Thermocoupler Attachment
Pin 2A for measurement of minimum
Pin (solder joint) temperature T
PRODUCT
) since this will likely be the warmest part of the
PRODUCT
PRODUCT
Technical Specification
EN/LZT 146 400 R3A March 2010
© Ericsson AB
Rev
B
Pin 8B for measurement of maximum
product temperature T
must not exceed 225 °C at any time.
must not exceed 260 °C at any time.
PIN
Reference
PRODUCT
L
, 217 to 221°C for
PIN
) in
1 (4)
29