AUIRF7737L2TR1 International Rectifier, AUIRF7737L2TR1 Datasheet - Page 2

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AUIRF7737L2TR1

Manufacturer Part Number
AUIRF7737L2TR1
Description
MOSFET N-CH 40V 315A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of AUIRF7737L2TR1

Input Capacitance (ciss) @ Vds
5469pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.9 mOhm @ 94A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
315A
Vgs(th) (max) @ Id
4V @ 150µA
Gate Charge (qg) @ Vgs
134nC @ 10V
Power - Max
3.3W
Mounting Type
*
Package / Case
*
Continuous Drain Current Id
31A
Drain Source Voltage Vds
40V
On Resistance Rds(on)
0.0015ohm
Rds(on) Test Voltage Vgs
10V
Transistor Case Style
DirectFET L6
No. Of Pins
3
Svhc
No SVHC
Rohs Compliant
Yes
Configuration
Single Hex Drain Hex Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.9 mOhms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
31 A
Power Dissipation
3.3 W
Gate Charge Qg
89 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ƒ Surface mounted on 1 in. square Cu
Notes  through Š are on page 10
V
∆V
R
V
∆V
gfs
R
I
I
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
Static Characteristics @ T
Dynamic Characteristics @ T
Diode Characteristics @ T
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
(still air).
(BR)DSS
DS(on)
GS(th)
G
iss
oss
rss
oss
oss
oss
SD
g
sw
oss
rr
Q
Q
Q
Q
2
(BR)DSS
GS(th)
gs1
gs2
godr
gd
eff.
/∆T
/∆T
J
J
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Forward Transconductance
Gate Resistance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Gate Charge Overdrive
Switch Charge (Q
Output Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Parameter
g
Parameter
Parameter
gs2
J
J
= 25°C (unless otherwise stated)
= 25°C (unless otherwise stated)
+ Q
J
gd
= 25°C (unless otherwise stated)
)
clip heatsink (still air)
Min.
Min.
Min.
–––
–––
–––
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
2.0
40
Typ.
Typ.
5469
1193
4296
1066
1615
0.03
Typ.
with small
–––
–––
–––
–––
–––
–––
534
–––
–––
–––
-10
0.6
1.5
3.0
89
18
34
29
42
39
12
19
22
14
35
32
8
Max. Units
Max. Units
Max.
-100
–––
–––
–––
–––
–––
250
100
134
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
156
624
1.3
1.9
4.0
53
48
5
mV/°C
Units
V/°C
mΩ
board with metalized back and with small
clip heatsink (still air)
µA
nA
nC
nC
pF
nC
ns
ns
‰ Mounted on minimum footprint full size
V
V
S
A
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
I
See Fig.11
V
V
I
R
V
V
ƒ = 1.0MHz
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
di/dt = 100A/µs
D
D
I
I
S
F
GS
GS
DS
DS
DS
DS
GS
GS
DS
DS
DD
GS
DS
GS
GS
GS
G
= 94A
= 94A
= 94A, V
= 94A, V
= 1.8Ω
= V
= 10V, I
= 40V, V
= 40V, V
= 20V, V
= 16V, V
= 25V
= 0V, I
= 10V, I
= 20V
= -20V
= 20V, V
= 0V
= 0V, V
= 0V, V
= 0V, V
GS
, I
D
DD
GS
D
DS
DS
DS
D
D
= 250µA
GS
GS
GS
GS
GS
Conditions
= 150µA
Conditions
= 94A
= 94A
Conditions
= 20V
= 1.0V, f=1.0MHz
= 32V, f=1.0MHz
= 0V to 32V
= 0V
= 0V
= 0V, T
= 10V
= 0V
= 10V
i
i
i
D
= 1mA
J
www.irf.com
i
= 125°C
G
D
S

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