IP3253CZ8-4,118 NXP Semiconductors, IP3253CZ8-4,118 Datasheet
IP3253CZ8-4,118
Specifications of IP3253CZ8-4,118
Related parts for IP3253CZ8-4,118
IP3253CZ8-4,118 Summary of contents
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IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network with high level ESD protection to IEC 61000-4-2 level 4 Rev. 03 — 23 March 2010 1. Product profile 1.1 General description The IP3253/54CZ8/CZ12/CZ16 family consists of 4-, 6- and 8-channel ...
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... NXP Semiconductors 2. Pinning information Table 1. Pinning IP3253/54CZ8/CZ12/CZ16 Pin Description CZ8 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground CZ12 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 fi ...
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... Conditions all pins to ground; contact discharge Human Body Model; MIL-STD-883, Method 3015 IEC 61000-4-2, level amb IP3253CZ8/CZ12/CZ16 IP3254CZ8/CZ12/CZ16 IP3253CZ8/CZ12/CZ16 IP3254CZ8/CZ12/CZ16 amb Rev. 03 — 23 March 2010 Version SOT983-1 SOT984-1 SOT985-1 SOT983-1 SOT984-1 SOT985-1 Min Max Unit ...
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... V bias(DC bias(DC) IP3254CZ8/CZ12/CZ16 V = 2.5 V bias(DC bias(DC) per channel 3 positive clamp negative clamp 3 Conditions source L 1 GHz < f < 4 GHz source L I IP3253CZ8/CZ12/CZ16 IP3254CZ8/CZ12/CZ16 measured attenuation; R source IP3253CZ8/CZ12/CZ16 IP3254CZ8/CZ12/CZ16 Rev. 03 — 23 March 2010 Min Typ Max - [ [ [ [ 0 Min Typ Max - 30 - ...
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... Channel 1 (pin 1 to pin 8) (2) Channel 4 (pin 4 to pin 5) Fig 2. IP3253CZ8 measured insertion loss magnitudes IP3253_54CZ8_CZ12_CZ16_3 Objective data sheet IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network IN 50 TEST BOARD V gen Test board PCB utilizes laser drilled micro-via holes which connect the ground plane to the device ground pins ...
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... NXP Semiconductors (dB (1) Channel 1 (pin 1 to pin 8) (2) Channel 4 (pin 4 to pin 5) Fig 3. IP3254CZ8 measured insertion loss magnitudes IP3253_54CZ8_CZ12_CZ16_3 Objective data sheet IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network 001aal112 (dB ( (MHz) (1) Channel 3 (pin 3 to pin 6) (2) Channel 2 (pin 2 to pin 7) Rev. 03 — ...
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... NXP Semiconductors 7. Package outline HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.75 mm 0.5 0.00 0.15 1 ...
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... NXP Semiconductors HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 2.55 mm 0.5 0.00 0.15 2.45 OUTLINE ...
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... NXP Semiconductors HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 3.35 mm 0.5 0.00 0.15 3.25 OUTLINE ...
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... Release date Data sheet status 20100323 Objective data sheet • Added type numbers IP3254CZ8, IP3254CZ12 and IP3254CZ16 20091016 Objective data sheet 20090514 Objective data sheet Rev. 03 — 23 March 2010 Change notice Supersedes - IP3253CZ8_CZ12_CZ16_2 - IP3253CZ8_CZ12_CZ16_1 - - © NXP B.V. 2010. All rights reserved ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 12. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Application information 6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Legal information 10.1 Data sheet status ...