PCF8564ACX9/1,005 NXP Semiconductors, PCF8564ACX9/1,005 Datasheet - Page 2

• Manufacturer Part Number: PCF8564ACX9/1,005
• Description: IC RTC/CALENDAR I2C 9BUMP
• Manufacturer: NXP Semiconductors
• Type: Clock/Calendar/Alarmr

Specifications of PCF8564ACX9/1,005

• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Function: Serial Clock, Alarm, Calendar, Timer, Timer Interrupt
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Mounting Style: SMD/SMT
• Rtc Bus Interface: I2C
• Supply Current: 1700 nA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: 568-6640; PCF8564ACX9/1,005

NXP Semiconductors
4. Ordering information
Table 1.
5. Marking
PCF8564A
Product data sheet
Type number
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/5GC/1
PCF8564AU/10AB/1
PCF8564ACX9/1
PCF8564ACX9/B/1
Ordering information
Table 2.
Package
Name
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564ACX9 wafer level chip-size package;
PCF8564ACX9 wafer level chip-size package;
Type number
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/5GC/1
PCF8564AU/10AB/1
PCF8564ACX9/1
PCF8564ACX9/B/1
Marking codes
All information provided in this document is subject to legal disclaimers.
Description
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
9 bumps; 1.27 × 1.9 × 0.29 mm
9 bumps; 1.27 × 1.9 × 0.29 mm
Rev. 02 — 30 September 2010
Marking code
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
Delivery form
unsawn wafer
unsawn wafer
unsawn wafer
wafer sawn on FFC
wafer sawn on FFC;
die with solder bumps
tape and reel;
die with solder bumps
Real time clock and calendar
PCF8564A
© NXP B.V. 2010. All rights reserved.
Version
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564ACX9
PCF8564ACX9
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