KMC8144VT1000A Freescale Semiconductor, KMC8144VT1000A Datasheet - Page 28

• Manufacturer Part Number: KMC8144VT1000A
• Description: IC DSP 783FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC81xx StarCorer
• Type: SC3400 Corer

Specifications of KMC8144VT1000A

• Interface: EBI/EMI, Ethernet, I²C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
• Clock Rate: 1.0GHz
• Non-volatile Memory: ROM (96 kB)
• On-chip Ram: 10.5MB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 90°C
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
2.3
Table 4
2.4
Table 5
28
DDR signal
DDR2 signal
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Notes:
provides information on the characteristics of the output driver strengths.
describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
1.
2.
3.
4.
5.
Default Output Driver Characteristics
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
5
1, 2
Characteristic
Driver Type
4
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 16
1, 3
Table 5. Thermal Characteristics for the MSC8144
Table 4. Output Drive Impedance
Symbol
R
R
R
R
θJC
θJA
θJA
θJB
Convection
Natural
0.8
Output Impedance (Ω)
20
15
7
35 (half strength mode)
29
FC-PBGA
×
29 mm
18
18
(1 m/s) airflow
200 ft/min
5
Freescale Semiconductor
15
12
°C/W
°C/W
°C/W
°C/W
Unit