XC3S50AN-4FTG256I Xilinx Inc, XC3S50AN-4FTG256I Datasheet - Page 23
XC3S50AN-4FTG256I
Manufacturer Part Number
XC3S50AN-4FTG256I
Description
IC FPGA SPARTAN-3AN 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Specifications of XC3S50AN-4FTG256I
Number Of Logic Elements/cells
1584
Number Of Labs/clbs
176
Total Ram Bits
55296
Number Of I /o
195
Number Of Gates
50000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S50AN-4FTG256I
Manufacturer:
Xilinx Inc
Quantity:
10 000
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Device DNA Read Endurance
Table 17: Device DNA Identifier Memory Characteristics
In-System Flash Memory Data Retention, Program/Write Endurance
Table 18: In-System Flash (ISF) Memory Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
Notes:
1.
ISF_PAGE_REWRITE
ISF_PAGE_CYCLES
ISF_SPR_CYCLES
ISF_SEC_CYCLES
ISF_RETENTION
DNA_CYCLES
Minimum value at which functionality is still guaranteed. Do not exceed these values.
ISF_ACTIVE
Symbol
Symbol
Number of READ operations or JTAG ISC_DNA read operations. Unaffected by
HOLD or SHIFT operations
Data retention
Time that the ISF memory is selected and active. SPI_ACCESS design primitive
pins CSB = Low, CLK toggling
Number of program/erase cycles, per ISF memory page
Number of cumulative random (non-sequential) page erase/program operations
within a sector before pages must be rewritten
Number of program/erase cycles for Sector Protection Register
Number of program cycles for Sector Lockdown Register per sector,
user-programmable field in Security Register, and Power-of-2 Page Size
Description
Description
www.xilinx.com
Spartan-3AN FPGA Family: DC and Switching Characteristics
Minimum
30,000,000
Minimum
100,000
10,000
10,000
20
2
1
(1)
Cycles
Cycles
Cycles
cycles
Units
Units
Years
Years
Cycle
Read
23
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