LPC11C24FBD48/301, NXP Semiconductors, LPC11C24FBD48/301, Datasheet - Page 50

• Manufacturer Part Number: LPC11C24FBD48/301,
• Description: TXRX CORTEX CAN 32K FLASH
• Manufacturer: NXP Semiconductors
• Series: LPC11Cxxr

Specifications of LPC11C24FBD48/301,

• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, CAN Transceiver, I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 36
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-6644; LPC11C24FBD48/301

NXP Semiconductors
11. Application information
LPC11CX2_CX4
Product data sheet
11.1 ADC usage notes
11.2 XTAL input
The following guidelines show how to increase the performance of the ADC in a noisy
environment beyond the ADC specifications listed in
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
capacitor to ground C
mode, a minimum of 200 mV(RMS) is needed.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 19
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer (see
Fig 23. Slave mode operation of the on-chip oscillator
•
•
•
•
i
S
= 100 pF. To limit the input voltage to the specified range, choose an additional
). Capacitance C
The ADC input trace must be short and as close as possible to the LPC11Cx2/Cx4
chip.
The ADC input traces must be shielded from fast switching digital signals and noisy
power supply lines.
Because the ADC and the digital core share the same power supply, the power supply
line must be adequately filtered.
To improve the ADC performance in a very noisy environment, put the device in Sleep
mode during the ADC conversion.
23), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
and
Table
All information provided in this document is subject to legal disclaimers.
Table
P
20. Since the feedback resistance is integrated on chip, only a crystal
in
g
Rev. 2 — 3 December 2010
which attenuates the input voltage by a factor C
Figure 24
X1
19).
and C
X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
XTALIN
LPC1xxx
C i
100 pF
, C
L
, R
S
002aae788
32-bit ARM Cortex-M0 microcontroller
C g
and C
Table
P
are supplied by the crystal
LPC11Cx2/Cx4
7:
i
/(C
© NXP B.V. 2010. All rights reserved.
Figure 24
i
+ C
g
). In slave
L
and
and in
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