STM32F100R8H6B STMicroelectronics, STM32F100R8H6B Datasheet - Page 78

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STM32F100R8H6B

Manufacturer Part Number
STM32F100R8H6B
Description
IC ARM CORTEX MCU 64KB 64TFBGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F100R8H6B

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFBGA
Core
ARM Cortex M3
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F100R8H6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F100R8H6B
Manufacturer:
ST
0
Package characteristics
78/87
Figure 41. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
Table 50.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Symbol
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
Seating
plane
0.150
0.250
4.850
4.850
Min
C
millimeters
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
A4
A1
A3
A2
A
0.785
0.200
0.300
5.000
3.500
5.000
3.500
0.500
0.750
0.080
0.150
0.050
Doc ID 16455 Rev 6
Typ
B
H
G
F
E
D
C
B
A
A1 ball pad corner
e
1.200
0.600
0.350
5.150
5.150
Max
1
2
3
4
Bottom view
D
D1
5
0.0059
0.0098
0.1909
0.1909
Øb (64 balls)
6
Min
7
F
8
inches
F
e
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
Typ
E1
ME_R8
(1)
E
A
0.0472
0.0236
0.0138
0.2028
0.2028
Max

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