STM32F100R8H6B STMicroelectronics, STM32F100R8H6B Datasheet - Page 79

• Manufacturer Part Number: STM32F100R8H6B
• Description: IC ARM CORTEX MCU 64KB 64TFBGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100R8H6B

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFBGA
• Core: ARM Cortex M3
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA)
1. Non solder mask defined (NSMD) pads are recommended
2. 4 to 6 mils solder paste screen printing process
Dpad
Dsm
Doc ID 16455 Rev 6
Pitch
D pad
Dsm
Solder paste
0.5 mm
0.27 mm
0.35 mm typ (depends on
the soldermask registration
tolerance)
0.27 mm aperture diameter
Package characteristics
ai15495
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