NX3L2G384GD,125 NXP Semiconductors, NX3L2G384GD,125 Datasheet - Page 2

IC ANALOG SWITCH SPST XSON8U

NX3L2G384GD,125

Manufacturer Part Number
NX3L2G384GD,125
Description
IC ANALOG SWITCH SPST XSON8U
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NX3L2G384GD,125

Number Of Switches
2
Switch Configuration
SPST
On Resistance (max)
1.6 Ohms
On Time (max)
48 ns
Off Time (max)
21 ns
Off Isolation (typ)
- 90 dB
Supply Voltage (max)
4.3 V
Supply Voltage (min)
1.4 V
Supply Current
690 nA, 800 nA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
XSON-8U
Minimum Operating Temperature
- 40 C
Off State Leakage Current (max)
+/- 500 nA
Operating Frequency
60 MHz
Power Dissipation
250 mW
Switch Current (typ)
+/- 350 mA, +/- 500 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5551-2
NXP Semiconductors
4. Ordering information
Table 1.
5. Marking
Table 2.
[1]
6. Functional diagram
NX3L2G384
Product data sheet
Type number
NX3L2G384GT
NX3L2G384GD
NX3L2G384GM
Type number
NX3L2G384GT
NX3L2G384GD
NX3L2G384GM
Fig 1. Logic symbol
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Ordering information
Marking codes
1Y
1E
2Z
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
[1]
001aai828
1Z
2Y
2E
All information provided in this document is subject to legal disclaimers.
XSON8
XSON8U plastic extremely thin small outline package; no leads;
XQFN8U plastic extremely thin quad flat package; no leads;
Rev. 4 — 28 December 2010
Description
plastic extremely thin small outline package; no leads;
8 terminals; body 1  1.95  0.5 mm
8 terminals; UTLP based; body 3  2  0.5 mm
8 terminals; body 1.6  1.6  0.5 mm
Dual low-ohmic single-pole single-throw analog switch
Marking code
ML2
ML2
ML2
Fig 2. Logic diagram (one switch)
E
Y
NX3L2G384
001aai598
© NXP B.V. 2010. All rights reserved.
Z
Version
SOT833-1
SOT996-2
SOT902-1
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