STW8Q2PA-S0-HA Seoul Semiconductor Inc, STW8Q2PA-S0-HA Datasheet - Page 21
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STW8Q2PA-S0-HA
Manufacturer Part Number
STW8Q2PA-S0-HA
Description
LED WARM WHITE 2700K 100MA SMD
Manufacturer
Seoul Semiconductor Inc
Datasheet
1.STW8Q2PA-S5-CA.pdf
(21 pages)
Specifications of STW8Q2PA-S0-HA
Lumens @ Current - Max
44lm
Lumens/watt @ Current - Test
91lm/W
Color
White, Warm
Current - Test
100mA
Luminous Flux @ Current - Test
29lm
Current - Max
160mA
Voltage - Forward (vf) Typ
3.2V
Wavelength
2700K
Lens Style/size
Rectangle with Flat Top
Viewing Angle
120°
Mounting Type
Surface Mount
Package / Case
4-SMD, Flat Leads
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
897-1075-2
STW8Q2PA-SO-HA
STW8Q2PA-SO-HA
3) When populating boards in SMT production, there are basically no restrictions regarding the form of the
pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants, silicone is
generally softer, and the surface is more likely to attract dust.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the
soldering of components.
5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
13. Handling of Silicone Resin LEDs
Document No. : SSC-QP-7-07-24
www.seoulsemicon.com
www.seoulsemicon.com
October 2010
October 2010
Rev. 05
Rev. 05